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Experimental characterization of Al – Cu Thermal contact resistance below 50 K
Santos Tomás, G. S.
(Speaker)
Krooshoop, H. J. G.
(Contributor)
J.J. Kosse (Contributor)
Dhallé, M. M. J.
(Contributor)
Martin van den Broek (Contributor)
Wessel, W. A. J.
(Contributor)
Sohrab Kamyar (Contributor)
ten Kate, H. H. J.
(Contributor)
ter Brake, H. J. M.
(Contributor)
Energy Materials Systems
Activity
:
Talk or presentation
›
Oral presentation
Description
Measurements of thermal contact resistance between bolted (6 x M5 - 5N/m) Aluminum (RRR 1600) and ETP Copper
Period
23 Jul 2019
Event title
2019 Cryogenic Engineering Conference and International Cryogenic Materials Conference, CEC/ICMC 2019
Event type
Conference
Sponsors
Ability Engineering Technology, Inc., Aerospace Fabrication and Materials, LLC, Beijing Sinoscience Fullcryo Technology Co., Ltd., Cryomech, Inc., Demaco Holland bv
Location
Hartford, United States, Connecticut
Show on map
Degree of Recognition
International
Keywords
TCR
Cryogenics
Thermal Contacts
TCC
Documents & Links
Experimental characterization of Al – Cu Thermal contact resistance below 50 K
File
:
application/pdf, 2.64 MB
Type
:
Text
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