Experimental characterization of Al – Cu Thermal contact resistance below 50 K

Activity: Talk or presentationOral presentation


Measurements of thermal contact resistance between bolted (6 x M5 - 5N/m) Aluminum (RRR 1600) and ETP Copper
Period23 Jul 2019
Event title2019 Cryogenic Engineering Conference and International Cryogenic Materials Conference, CEC/ICMC 2019
Event typeConference
SponsorsAbility Engineering Technology, Inc., Aerospace Fabrication and Materials, LLC, Beijing Sinoscience Fullcryo Technology Co., Ltd., Cryomech, Inc., Demaco Holland bv
LocationHartford, United States, ConnecticutShow on map
Degree of RecognitionInternational


  • TCR
  • Cryogenics
  • Thermal Contacts
  • TCC