Experimental characterization of Al – Cu Thermal contact resistance below 50 K

Santos Tomás, G. S. (Speaker), Krooshoop, H. J. G. (Contributor), Kosse, J. J. (Contributor), Dhallé, M. M. J. (Contributor), Martin van den Broek (Contributor), Wessel, W. A. J. (Contributor), Sohrab Kamyar (Contributor), ten Kate, H. H. J. (Contributor), ter Brake, H. J. M. (Contributor)

Activity: Talk or presentation › Oral presentation

Description

Measurements of thermal contact resistance between bolted (6 x M5 - 5N/m) Aluminum (RRR 1600) and ETP Copper
Period23 Jul 2019
Event title2019 Cryogenic Engineering Conference and International Cryogenic Materials Conference, CEC/ICMC 2019
Event typeConference
LocationHartford, United States, Connecticut
Degree of RecognitionInternational

Keywords

  • TCR
  • Cryogenics
  • Thermal Contacts
  • TCC

Documents & Links