Thermal management through in-board heat pipes manufactured using printed circuit board multilayer technology

Wits, W. W. (Speaker)

    Activity: Talk or presentation › Oral presentation

    Period8 Nov 2006
    Event titleThe 31st IEEE/CPMT International Electronic manufacturing Technology Symposium: null
    Event typeConference
    LocationPetaling Yaja, Malaysia
    Degree of RecognitionInternational

    Keywords

    • METIS-235367