Thermal management through in-board heat pipes manufactured using printed circuit board multilayer technology

    Activity: Talk or presentationOral presentation

    Period8 Nov 2006
    Event titleThe 31st IEEE/CPMT International Electronic manufacturing Technology Symposium
    Event typeConference
    LocationPetaling Yaja, MalaysiaShow on map
    Degree of RecognitionInternational

    Keywords

    • METIS-235367