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Thermal management through in-board heat pipes manufactured using printed circuit board multilayer technology
Wits, W. W.
(Speaker)
Activity
:
Talk or presentation
›
Oral presentation
Period
8 Nov 2006
Event title
The 31st IEEE/CPMT International Electronic manufacturing Technology Symposium
Event type
Conference
Location
Petaling Yaja, Malaysia
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Degree of Recognition
International
Keywords
METIS-235367