Physics
Cooling
100%
Sorption
89%
Temperature
69%
Helium
48%
Wafer
40%
Utilization
40%
High Pressure
36%
Adsorption
34%
Hydrogen
31%
Free Vibration
31%
Cryogenics
28%
Low Pressure
27%
Technology
26%
Nitrogen
25%
Working Fluid
19%
Gaseous State
15%
Fabrication
14%
Vibration
14%
Counterflow
12%
Strength of Materials
12%
Heat
12%
Interference
10%
Low Noise
10%
Joule-Thomson Effect
10%
Heat Sink
10%
Telescope
10%
Optics
10%
Interferometer
10%
Space Missions
9%
Packing Density
8%
Thermal Expansion
8%
Volume
8%
Glass
8%
Entropy
8%
Optimization
8%
Amplifier
6%
Area
5%
Pressure
5%
Performance
5%
Electromagnetic Interference
5%
Engineering
Stages
66%
Fluid
30%
Free Vibration
25%
Joule
25%
High Pressure
25%
Design
24%
Temperature
24%
Prototype
20%
Low Pressure
20%
Development
20%
Cooling Power
15%
Experiments
15%
Applications
15%
Lower Temperature
15%
Moving Part
14%
Counterflow Heat Exchanger
10%
Microcooler
10%
Entropy Production
10%
Minimization
10%
Fabrication
10%
Evaporator
10%
Specific Issue
10%
Experimental Result
10%
Microelectromechanical System
10%
Multistage
10%
Forming
10%
Limitations
10%
Microelectro
10%
Reversible Process
10%
Technology Readiness Level
10%
Space Cooling
10%
Electromagnetic Interference
10%
Activated Carbon
9%
Input Power
9%
Continuous Operation
6%
Reduction
5%
Cryogenic Cooling
5%
Orbits
5%
Cooling Effect
5%
Example Application
5%
Preliminary Design
5%
Check Valve
5%
Joule-Thomson Effect
5%
Return Fluid
5%
Spacecraft
5%
Good Choice
5%
Special Attention
5%
Expansion Process
5%
Cycles
5%
Sensor System
5%
Material Science
Temperature
55%
Helium
40%
Electronics
40%
Detector
40%
Bar (Metal)
38%
Fluid
23%
Heat Exchanger
20%
Gas
13%
Electronic Device
13%
Mechanical Property
12%
Density
12%
Heat Sink
10%
Amplifier
10%
Adsorption
10%
Paper
10%
Material
10%
Thermal Expansion
8%
Superconductivity
6%
Microelectromechanical System
6%
Liquid
6%
Glass
6%
