1989 …2019
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Research Output 1989 2019

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Conference article
1997
93 Citations (Scopus)
348 Downloads (Pure)

RIE lag in high aspect ratio trench etching of silicon

Jansen, H., de Boer, M., Wiegerink, R., Tas, N., Smulders, E., Neagu, C. & Elwenspoek, M., Feb 1997, In : Microelectronic engineering. 35, 1-4, p. 45-50 6 p.

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Reactive ion etching
Silicon
high aspect ratio
Aspect ratio
Etching