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Wafer-scale 3D shaping of high aspect ratio structures by multistep plasma etching and corner lithography
Ni, S., Berenschot, E. J. W., Westerik, P. J., de Boer, M. J., Wolf, R., Le-The, H., Gardeniers, H. J. G. E. & Tas, N. R., 23 Mar 2020, In: Microsystems and Nanoengineering. 6, 1, 25.Research output: Contribution to journal › Article › Academic › peer-review
Open AccessFile13 Link opens in a new tab Citations (Scopus)149 Downloads (Pure)