Shu Ni

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20202020

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Research Output

Wafer-scale 3D shaping of high aspect ratio structures by multistep plasma etching and corner lithography

Ni, S., Berenschot, E. J. W., Westerik, P. J., de Boer, M. J., Wolf, R., Le-The, H., Gardeniers, H. J. G. E. & Tas, N. R., 23 Mar 2020, In : Microsystems and Nanoengineering. 6, 1, 25.

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