Engineering & Materials Science
Graphene
100%
Etching
51%
Thin films
50%
Fracture toughness
31%
Membranes
30%
Molecular oxygen
27%
Transition metals
23%
Chemical vapor deposition
23%
Silicon oxides
22%
Defects
21%
Silicides
21%
Oxygen
21%
Hydrogen
20%
Physical vapor deposition
19%
Optical sensors
19%
Plasma enhanced chemical vapor deposition
18%
Metals
18%
Oxidation
18%
Boron
18%
Atomic layer deposition
16%
Delamination
15%
Multilayers
15%
Aluminum oxide
15%
Stoichiometry
14%
Vapors
14%
Oxides
13%
Catalyst activity
13%
Spectroscopic ellipsometry
12%
Copper
12%
Crystal defects
12%
Amorphous carbon
12%
Chemical analysis
12%
Atomic force microscopy
11%
Cracks
10%
Substrates
10%
Microfabrication
10%
Graphene devices
9%
Grain boundaries
9%
Magnetron sputtering
8%
Electric potential
8%
Crystalline materials
7%
Deposition rates
6%
Tensile stress
6%
Amorphous films
6%
Carbon films
6%
Nanopores
5%
Strategic materials
5%
Yttrium
5%
Residual stresses
5%
Boron nitride
5%
Chemistry
Graphene
60%
Etching
45%
Multilayer
42%
Fracture Strength
34%
Physical Vapour Deposition
20%
Aluminium Oxide
20%
Magnetic Material
19%
Spectroelectrochemistry
19%
Delamination
18%
Oxidation Kinetics
18%
Chemical Vapour Deposition
17%
Plasma Enhanced Chemical Vapour Deposition
15%
Liquid Film
14%
Boron Atom
13%
Hydrogen
13%
Dioxygen
12%
Resistance
12%
Crystal Defect
12%
Atomic Layer Epitaxy
12%
Transition Element
11%
Voltage
11%
Grain Boundary
10%
Residual Stress
10%
Strength
10%
Pressure
9%
Diffusion
9%
Metal
9%
Polycrystalline Solid
9%
Magnetron Sputtering
9%
Oxide
8%
Application
7%
Atomic Force Microscopy
7%
Ellipsometry
7%
Low Pressure Chemical Vapour Deposition
5%
Amorphous Material
5%
Physics & Astronomy
graphene
69%
etching
37%
membranes
27%
synthesis
22%
electrochemistry
20%
optical measuring instruments
17%
pinholes
17%
thin films
17%
vapor deposition
16%
defects
16%
hydrogen
16%
boron
13%
Raman spectroscopy
13%
aluminum oxides
12%
breakdown
12%
adsorption
12%
silicon nitrides
11%
atomic layer epitaxy
11%
high voltages
10%
catalytic activity
10%
causes
9%
electric potential
9%
characterization
8%
cells
8%
masks
8%
atomic force microscopy
7%
manufacturing
6%
self alignment
5%
sequencing
5%
carbon
5%
potassium
5%
molybdenum disulfides
5%
heating
5%