Activities per year
- 19 results
Search results
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Advances in additive manufacturing for heat pipe applications
Wits, W. W. (Speaker)
8 Feb 2023Activity: Talk or presentation › Invited talk
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Materials development for additive manufacturing exploiting 2D materials for thermal management
Wits, W. W. (Speaker)
8 Nov 2023Activity: Talk or presentation › Invited talk
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Design and process strategies for metal additive manufacturing
Wits, W. W. (Speaker)
16 Jun 2014Activity: Talk or presentation › Oral presentation
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Additive Manufacturing: Design, Process & Quality Control
Wits, W. W. (Speaker)
11 Jun 2014Activity: Talk or presentation › Oral presentation
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Micro-CT of additive manufactured parts
Wits, W. W. (Speaker) & Carmignato, S. (Speaker)
24 Aug 2014Activity: Talk or presentation › Oral presentation
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Design rules for Additive Manufacturing (AM)
Wits, W. W. (Speaker)
24 Jun 2013Activity: Talk or presentation › Oral presentation
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Inkjet Printing of 3D Metallic Silver Complex Microstructures
Wits, W. W. (Speaker)
3 Feb 2010Activity: Talk or presentation › Oral presentation
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3D Displays for design engineering
Wits, W. W. (Speaker)
14 Nov 2010Activity: Talk or presentation › Oral presentation
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Full immersion TRIZ in education
Wits, W. W. (Speaker)
3 Nov 2010Activity: Talk or presentation › Oral presentation
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TRIZ based Interface conflict resolving strategies for modular product architectures
Wits, W. W. (Speaker)
3 Nov 2010Activity: Talk or presentation › Oral presentation
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TRIZ Summercourse & University of Twente
Wits, W. W. (Speaker)
17 Jun 2009Activity: Talk or presentation › Oral presentation
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Copper Foam for Capillary Structures in Heat Pipes
Wits, W. W. (Speaker)
8 Sept 2009Activity: Talk or presentation › Oral presentation
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TRIZ Summercourse 2009: Impression and outlook
Wits, W. W. (Speaker)
11 Nov 2009Activity: Talk or presentation › Oral presentation
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Flat miniature heat pipes in printed circuit boards
Wits, W. W. (Speaker)
20 Nov 2008Activity: Talk or presentation › Oral presentation
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Selecting capillary structures for heat pipes in multilayer printed circuit boards
Wits, W. W. (Speaker)
18 May 2008Activity: Talk or presentation › Oral presentation
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Modelling the transient analysis of flat miniature heat pipes in printed circuit boards using a control volume approach
Wits, W. W. (Speaker) & Kok, J. B. W. (Contributor)
18 May 2008Activity: Talk or presentation › Oral presentation
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Novel cooling strategy for electronic packages: directly injected cooling
Wits, W. W. (Speaker)
7 Apr 2008Activity: Talk or presentation › Oral presentation
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Thermal management through in-board heat pipes manufactured using printed circuit board multilayer technology
Wits, W. W. (Speaker)
8 Nov 2006Activity: Talk or presentation › Oral presentation