µTransparent Insulating Channels as Components for Miniaturized Chemical Separation Devices

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Abstract

Currently, miniaturized devices that apply electro osmotic pumping or electrophoretic separations are mostly constructed by etching small insulating channels for supply and separation on glass substrates. In principle, silicon is a superior construction material in terms of inertness and design flexibility. However, because of its semiconducting properties, the use in high voltage applications like the ones mentioned above is quite limited. In this paper, the use of μTransparent Insulating Channel (μTIC) technology is demonstrated as a standard procedure to manufacture miniaturized analytical separation devices. This technique, μchannels having extremely thin, transparent and insulating walls can be fabricated. An overview of the impact of this technology is given, showing the advantages of a fabrication technology that is as flexible as silicon technology for the fabrication of μTAS or “lab on a chip” devices. The following basic technology and control parameters will be highlighted. 1. Up to 100 μm wide rectangular channels 2. Bosses and leak-free connections to external μ fluidics. 3. Web-like structures for inlets/outlets>100 μm. 4. Implementation of conductivity electrodes 5. Good thermal dissipation properties of the thin walls 6. Control of the electro osmotic flow by a radial voltage.
Original languageEnglish
Pages20-24
DOIs
Publication statusPublished - 2000
Event2000 International Microprocesses and Nanotechnology Conference - Tokyo, Japan
Duration: 11 Jul 200013 Jul 2000

Conference

Conference2000 International Microprocesses and Nanotechnology Conference
CountryJapan
CityTokyo
Period11/07/0013/07/00

Keywords

  • IR-55946

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    Schasfoort, R. B. M., Hendrikse, J., & van den Berg, A. (2000). µTransparent Insulating Channels as Components for Miniaturized Chemical Separation Devices. 20-24. Paper presented at 2000 International Microprocesses and Nanotechnology Conference, Tokyo, Japan. https://doi.org/10.1109/IMNC.2000.872604