2D and 3D interconnect fabrication by picosecond laser induced forward transfer

G. Oosterhuis, Bert Huis in 't Veld, P. Chall

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademic

    3 Citations (Scopus)
    Original languageUndefined
    Title of host publicationProceedings of the 11th EUSPEN international conference
    EditorsH. Spaan, P Shore
    Place of PublicationLake Como, Italy
    PublisherEUSPEN
    Pages484-488
    ISBN (Print)978-0-9553082-9-1
    Publication statusPublished - 23 May 2011
    Event11th EUSPEN International Conference 2011 - Spazio Villa Erba Congress Centre, Lake Como, Italy
    Duration: 23 May 201126 May 2011
    Conference number: 11

    Publication series

    Name
    Volume2

    Conference

    Conference11th EUSPEN International Conference 2011
    Abbreviated titleEUSPEN
    CountryItaly
    CityLake Como
    Period23/05/1126/05/11

    Keywords

    • METIS-277156

    Cite this

    Oosterhuis, G., Huis in 't Veld, B., & Chall, P. (2011). 2D and 3D interconnect fabrication by picosecond laser induced forward transfer. In H. Spaan, & P. Shore (Eds.), Proceedings of the 11th EUSPEN international conference (pp. 484-488). Lake Como, Italy: EUSPEN.