2D and 3D interconnect fabrication by picosecond laser induced forward transfer

G. Oosterhuis, Bert Huis in 't Veld, P. Chall

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademic

    3 Citations (Scopus)
    Original languageUndefined
    Title of host publicationProceedings of the 11th EUSPEN international conference
    EditorsH. Spaan, P Shore
    Place of PublicationLake Como, Italy
    PublisherEUSPEN
    Pages484-488
    ISBN (Print)978-0-9553082-9-1
    Publication statusPublished - 23 May 2011
    Event11th EUSPEN International Conference 2011 - Spazio Villa Erba Congress Centre, Lake Como, Italy
    Duration: 23 May 201126 May 2011
    Conference number: 11

    Publication series

    Name
    Volume2

    Conference

    Conference11th EUSPEN International Conference 2011
    Abbreviated titleEUSPEN
    CountryItaly
    CityLake Como
    Period23/05/1126/05/11

    Keywords

    • METIS-277156

    Cite this

    Oosterhuis, G., Huis in 't Veld, B., & Chall, P. (2011). 2D and 3D interconnect fabrication by picosecond laser induced forward transfer. In H. Spaan, & P. Shore (Eds.), Proceedings of the 11th EUSPEN international conference (pp. 484-488). Lake Como, Italy: EUSPEN.
    Oosterhuis, G. ; Huis in 't Veld, Bert ; Chall, P. / 2D and 3D interconnect fabrication by picosecond laser induced forward transfer. Proceedings of the 11th EUSPEN international conference. editor / H. Spaan ; P Shore. Lake Como, Italy : EUSPEN, 2011. pp. 484-488
    @inproceedings{a634938c8b464e0ab87c7f9e8184f4f2,
    title = "2D and 3D interconnect fabrication by picosecond laser induced forward transfer",
    keywords = "METIS-277156",
    author = "G. Oosterhuis and {Huis in 't Veld}, Bert and P. Chall",
    year = "2011",
    month = "5",
    day = "23",
    language = "Undefined",
    isbn = "978-0-9553082-9-1",
    publisher = "EUSPEN",
    pages = "484--488",
    editor = "H. Spaan and P Shore",
    booktitle = "Proceedings of the 11th EUSPEN international conference",

    }

    Oosterhuis, G, Huis in 't Veld, B & Chall, P 2011, 2D and 3D interconnect fabrication by picosecond laser induced forward transfer. in H Spaan & P Shore (eds), Proceedings of the 11th EUSPEN international conference. EUSPEN, Lake Como, Italy, pp. 484-488, 11th EUSPEN International Conference 2011, Lake Como, Italy, 23/05/11.

    2D and 3D interconnect fabrication by picosecond laser induced forward transfer. / Oosterhuis, G.; Huis in 't Veld, Bert; Chall, P.

    Proceedings of the 11th EUSPEN international conference. ed. / H. Spaan; P Shore. Lake Como, Italy : EUSPEN, 2011. p. 484-488.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademic

    TY - GEN

    T1 - 2D and 3D interconnect fabrication by picosecond laser induced forward transfer

    AU - Oosterhuis, G.

    AU - Huis in 't Veld, Bert

    AU - Chall, P.

    PY - 2011/5/23

    Y1 - 2011/5/23

    KW - METIS-277156

    M3 - Conference contribution

    SN - 978-0-9553082-9-1

    SP - 484

    EP - 488

    BT - Proceedings of the 11th EUSPEN international conference

    A2 - Spaan, H.

    A2 - Shore, P

    PB - EUSPEN

    CY - Lake Como, Italy

    ER -

    Oosterhuis G, Huis in 't Veld B, Chall P. 2D and 3D interconnect fabrication by picosecond laser induced forward transfer. In Spaan H, Shore P, editors, Proceedings of the 11th EUSPEN international conference. Lake Como, Italy: EUSPEN. 2011. p. 484-488