2D Modelling of Mechanical Stress Evolution and Electromigration in Confined Aluminium Interconnects

V. Petrescu, A.J. Mouthaan

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

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    Abstract

    A complete description for mechanical stress evolution and electromigration in confined Al interconnects, taking into account the microstructure features, is presented in this paper. In the last years there were proposed several 1D models for the time-dependent evolution of the mechanical stress in Al interconnect lines, since the time to failure of the line can be related to the time a critical value of the stress is reached. The present paper extends and improves the existing models in 2D using a two dimensional simulator based on finite element method. Also, the model makes an attempt to relate the stress/vacancy concentration evolution with the early resistance change of the Al line
    Original languageUndefined
    Title of host publicationProceedings of 21st International Conference on Microelectronics (MIEL 97)
    Place of PublicationNIS Yugoslavia
    PublisherIEEE
    Pages629-632
    Number of pages4
    ISBN (Print)0-7803-3664-X
    DOIs
    Publication statusPublished - 30 Dec 1997

    Publication series

    Name
    PublisherIEEE
    Volume2

    Keywords

    • METIS-113869
    • IR-16984

    Cite this

    Petrescu, V., & Mouthaan, A. J. (1997). 2D Modelling of Mechanical Stress Evolution and Electromigration in Confined Aluminium Interconnects. In Proceedings of 21st International Conference on Microelectronics (MIEL 97) (pp. 629-632). NIS Yugoslavia: IEEE. https://doi.org/10.1109/ICMEL.1997.632920
    Petrescu, V. ; Mouthaan, A.J. / 2D Modelling of Mechanical Stress Evolution and Electromigration in Confined Aluminium Interconnects. Proceedings of 21st International Conference on Microelectronics (MIEL 97). NIS Yugoslavia : IEEE, 1997. pp. 629-632
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    abstract = "A complete description for mechanical stress evolution and electromigration in confined Al interconnects, taking into account the microstructure features, is presented in this paper. In the last years there were proposed several 1D models for the time-dependent evolution of the mechanical stress in Al interconnect lines, since the time to failure of the line can be related to the time a critical value of the stress is reached. The present paper extends and improves the existing models in 2D using a two dimensional simulator based on finite element method. Also, the model makes an attempt to relate the stress/vacancy concentration evolution with the early resistance change of the Al line",
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    Petrescu, V & Mouthaan, AJ 1997, 2D Modelling of Mechanical Stress Evolution and Electromigration in Confined Aluminium Interconnects. in Proceedings of 21st International Conference on Microelectronics (MIEL 97). IEEE, NIS Yugoslavia, pp. 629-632. https://doi.org/10.1109/ICMEL.1997.632920

    2D Modelling of Mechanical Stress Evolution and Electromigration in Confined Aluminium Interconnects. / Petrescu, V.; Mouthaan, A.J.

    Proceedings of 21st International Conference on Microelectronics (MIEL 97). NIS Yugoslavia : IEEE, 1997. p. 629-632.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

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    N2 - A complete description for mechanical stress evolution and electromigration in confined Al interconnects, taking into account the microstructure features, is presented in this paper. In the last years there were proposed several 1D models for the time-dependent evolution of the mechanical stress in Al interconnect lines, since the time to failure of the line can be related to the time a critical value of the stress is reached. The present paper extends and improves the existing models in 2D using a two dimensional simulator based on finite element method. Also, the model makes an attempt to relate the stress/vacancy concentration evolution with the early resistance change of the Al line

    AB - A complete description for mechanical stress evolution and electromigration in confined Al interconnects, taking into account the microstructure features, is presented in this paper. In the last years there were proposed several 1D models for the time-dependent evolution of the mechanical stress in Al interconnect lines, since the time to failure of the line can be related to the time a critical value of the stress is reached. The present paper extends and improves the existing models in 2D using a two dimensional simulator based on finite element method. Also, the model makes an attempt to relate the stress/vacancy concentration evolution with the early resistance change of the Al line

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    Petrescu V, Mouthaan AJ. 2D Modelling of Mechanical Stress Evolution and Electromigration in Confined Aluminium Interconnects. In Proceedings of 21st International Conference on Microelectronics (MIEL 97). NIS Yugoslavia: IEEE. 1997. p. 629-632 https://doi.org/10.1109/ICMEL.1997.632920