2D Modelling of Mechanical Stress Evolution and Electromigration in Confined Aluminium Interconnects

V. Petrescu, A.J. Mouthaan

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    A complete description for mechanical stress evolution and electromigration in confined Al interconnects, taking into account the microstructure features, is presented in this paper. In the last years there were proposed several 1D models for the time-dependent evolution of the mechanical stress in Al interconnect lines, since the time to failure of the line can be related to the time a critical value of the stress is reached. The present paper extends and improves the existing models in 2D using a two dimensional simulator based on finite element method. Also, the model makes an attempt to relate the stress/vacancy concentration evolution with the early resistance change of the Al line
    Original languageUndefined
    Title of host publicationProceedings of 21st International Conference on Microelectronics (MIEL 97)
    Place of PublicationNIS Yugoslavia
    Number of pages4
    ISBN (Print)0-7803-3664-X
    Publication statusPublished - 30 Dec 1997
    Event21st International Conference on Microelectronics, MIEL 1997, NIS, Yugoslavia - Nis, Serbia
    Duration: 14 Sep 199717 Sep 1997

    Publication series



    Conference21st International Conference on Microelectronics, MIEL 1997, NIS, Yugoslavia
    Other14-17 September 1997


    • METIS-113869
    • IR-16984

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