3D Nanofabrication of components by repeated corner lithography: Self Aligned sub-50nm apertures

N. Burouni, Johan W. Berenschot, Michael Curt Elwenspoek, Niels Roelof Tas

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    Repeated corner lithography is an innovative method in wafer scale to obtain three dimensional nano structures, which are uniform and compatible with geometrical expectation. In this paper we present novel sub-50nm apertures fabricated by repeated corner lithography. An important result from the presented work is that it is possible to control the aperture size and feature by initial layer thickness of nitride and proper choice of LOCOS temperature and oxidation time.
    Original languageUndefined
    Title of host publicationProceedings of the 12th IEEE International Conference on Nanotechnology (IEEE- NANO)
    Place of PublicationHoes Lane, USA
    Number of pages5
    ISBN (Print)978-1-4673-2198-3
    Publication statusPublished - 20 Aug 2012
    Event12th IEEE International Conference on Nanotechnology, IEEE- NANO 2012 - Birmingham, UK
    Duration: 20 Aug 201223 Aug 2012

    Publication series

    ISSN (Print)1944-9399


    Conference12th IEEE International Conference on Nanotechnology, IEEE- NANO 2012
    Other20-23 August 2012


    • EWI-23295
    • LOCOS temperature
    • oxidation time
    • innovative method
    • three dimensional nano structures
    • IR-85694
    • size 50 nm
    • repeated corner lithography
    • 3D nanofabrication
    • METIS-296409
    • geometrical expectation

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