3D Printing of Electrically Conductive Silver Nanoparticle-Embedded Foams for Pressure Sensor Applications

Guanxing Kuang*, Olivier Jérémie Nguon, Mohammad Mehrali*, Johan Evert Ten Elshof, Wilko Rohlfs*, Claas Willem Visser*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

Abstract

Flexible pressure sensors with high sensitivity have gained considerable attention in the electronic skin, human motion control, and health monitoring fields. Porous structures strongly enhance the compressibility and sensitivity in piezoresistive sensors compared with bulk materials. However, traditional foam fabrication methods lead to poor adhesion between nanofillers and polymer matrix, instability, complexity, and low reproducibility. We report a single-step 3D printing process for silver nanoparticle-embedded foams, creating pressure sensors with controlled conductivity, shape, and stiffness. Our silver nanoparticle-embedded foam-based sensors achieve high sensitivity with a wide working range and minimal hysteresis. Additionally, these sensors demonstrated robust durability, maintaining consistent resistance signals across 250 cyclic tests, and are integrated into a pressure patch and smart shoe sole for human motion monitoring.

Original languageEnglish
Title of host publication2024 IEEE Sensors
PublisherIEEE
ISBN (Electronic)9798350363517
DOIs
Publication statusPublished - 17 Dec 2024
EventIEEE SENSORS 2024 - Kobe Portopia Hotel, Kobe, Japan
Duration: 20 Oct 202423 Oct 2024
https://2024.ieee-sensorsconference.org/

Publication series

NameProceedings of IEEE Sensors
ISSN (Print)1930-0395
ISSN (Electronic)2168-9229

Conference

ConferenceIEEE SENSORS 2024
Country/TerritoryJapan
CityKobe
Period20/10/2423/10/24
Internet address

Keywords

  • 2025 OA procedure
  • Conductive polymer composite foams
  • Health Monitoring
  • Photopolymerization
  • Piezoresistive pressure sensor
  • Sensitivity
  • Additive manufacturing

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