3D Thermal/Electrical Simulation of Breakdown in a BJT Using a Circuit Simulator and a Layout-to-Circuit Extraction Tool

B.H. Krabbenborg, H.C. de Graaff, A.J. Mouthaan, H. Boezen, A. Bosma, C. Tekin

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

Keywords

@inproceedings{eaad1646e0a743e59f00a42ea8ae3de5,

title = "3D Thermal/Electrical Simulation of Breakdown in a BJT Using a Circuit Simulator and a Layout-to-Circuit Extraction Tool",

keywords = "METIS-114005",

author = "B.H. Krabbenborg and {de Graaff}, H.C. and A.J. Mouthaan and H. Boezen and A. Bosma and C. Tekin",

year = "1993",

month = sep,

day = "6",

language = "Undefined",

pages = "57--60",

booktitle = "Proceedings SISDEP '93",

}

TY - GEN

T1 - 3D Thermal/Electrical Simulation of Breakdown in a BJT Using a Circuit Simulator and a Layout-to-Circuit Extraction Tool

AU - Krabbenborg, B.H.

AU - de Graaff, H.C.

AU - Mouthaan, A.J.

AU - Boezen, H.

AU - Bosma, A.

AU - Tekin, C.

PY - 1993/9/6

Y1 - 1993/9/6

KW - METIS-114005

M3 - Conference contribution

SP - 57

EP - 60

BT - Proceedings SISDEP '93

CY - Vienna, Austria

ER -