3D Thermal/Electrical Simulation of Breakdown in a BJT Using a Circuit Simulator and a Layout-to-Circuit Extraction Tool

B.H. Krabbenborg, H.C. de Graaff, A.J. Mouthaan, H. Boezen, A. Bosma, C. Tekin

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    Original languageUndefined
    Title of host publicationProceedings SISDEP '93
    Place of PublicationVienna, Austria
    Pages57-60
    Publication statusPublished - 6 Sep 1993

    Keywords

    • METIS-114005

    Cite this

    Krabbenborg, B. H., de Graaff, H. C., Mouthaan, A. J., Boezen, H., Bosma, A., & Tekin, C. (1993). 3D Thermal/Electrical Simulation of Breakdown in a BJT Using a Circuit Simulator and a Layout-to-Circuit Extraction Tool. In Proceedings SISDEP '93 (pp. 57-60). Vienna, Austria.