3D Thermal/Electrical Simulation of Breakdown in a BJT Using a Circuit Simulator and a Layout-to-Circuit Extraction Tool

B.H. Krabbenborg, H.C. de Graaff, A.J. Mouthaan, H. Boezen, A. Bosma, C. Tekin

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    Original languageUndefined
    Title of host publicationProceedings SISDEP '93
    Place of PublicationVienna, Austria
    Publication statusPublished - 6 Sept 1993


    • METIS-114005

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