45° light turning mirrors for hybrid integration of silica optical waveguides and photo-detectors

F. Çivitci, G. Sengo, A. Driessen, Markus Pollnau, Hugo Hoekstra, Anne J. Annema

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademic

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    Abstract

    For hybrid integration of an optical chip with an electronic chip with photo diodes and electronic processing, light must be coupled from the optical chip to the electronic chip. This paper presents a method to fabricate metal-free 45° quasi-total internal reflecting mirrors in optical chips that enable 90° out-of-plane light coupling between flip-chip bonded chips. This method is fully compatible with fabrication of conventional optical chips. The mirrors are created using anisotropic etching of 45° facets in a Si substrate followed by fabrication of optical structures. After removal of the mirror-defining Si structures by isotropic etching, the obtained air-optical structure interface directs the output of the waveguides to out-of-plane photo detectors that are mounted flip-chip on the optical chip. Simulations show a reflection efficiency of 72.3 %, while experimentally 47% was measured on a not fully optimized first batch.
    Original languageEnglish
    Title of host publication16th European Conference on Integrated Optics, ECIO 2012
    Place of PublicationCastelldefels/Barcelona
    PublisherInsitut de Ciències Fotòniques
    Number of pages2
    Publication statusPublished - Apr 2012
    Event16th European Conference on Integrated Optics, ECIO 2012 - Sitges-Barcelona, Spain
    Duration: 18 Apr 201220 Apr 2012
    Conference number: 16

    Conference

    Conference16th European Conference on Integrated Optics, ECIO 2012
    Abbreviated titleECIO
    CountrySpain
    CitySitges-Barcelona
    Period18/04/1220/04/12

    Keywords

    • Light turning mirrors
    • Integrated Optics
    • Hybrid integration
    • Photo-detector arrays
    • IOMS-SNS: SENSORS
    • Silica waveguides

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