A 2D particle velocity sensor with minimal flow-disturbance

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

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Abstract

A 2D sound particle velocity sensor, consisting of a cross of two connected, heated wires is presented. We developed a fabrication process by which the wires become freely suspended 350 μm above the chip surface. This largely eliminates the influence of boundary layer effects and increases the temperature gradient along the wires, both due to the large distance to the silicon substrate. As a result, the sensor has increased sensitivity and reduced power consumption compared to an earlier design [1]. Furthermore, due to the fully symmetrical structure of the sensor the sensitive directions are exactly orthogonal to each other and have near identical sensitivity, thus requiring no individual calibration.
Original languageUndefined
Title of host publicationProceedings IEEE Sensors 2015
Place of PublicationPiscataway
PublisherIEEE
Pages1307-1310
Number of pages4
ISBN (Print)978-1-4799-8203-5
DOIs
Publication statusPublished - 1 Nov 2015
Event2015 IEEE Sensors - Busan Exhibition and Convention Center, Busan, Korea, Republic of
Duration: 1 Nov 20154 Nov 2015

Publication series

Name
PublisherIEEE

Conference

Conference2015 IEEE Sensors
CountryKorea, Republic of
CityBusan
Period1/11/154/11/15

Keywords

  • EWI-26761
  • IR-99322
  • METIS-315574
  • TST-Life like

Cite this

Pjetri, O. ; Wiegerink, Remco J. ; Krijnen, Gijsbertus J.M. / A 2D particle velocity sensor with minimal flow-disturbance. Proceedings IEEE Sensors 2015. Piscataway : IEEE, 2015. pp. 1307-1310
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abstract = "A 2D sound particle velocity sensor, consisting of a cross of two connected, heated wires is presented. We developed a fabrication process by which the wires become freely suspended 350 μm above the chip surface. This largely eliminates the influence of boundary layer effects and increases the temperature gradient along the wires, both due to the large distance to the silicon substrate. As a result, the sensor has increased sensitivity and reduced power consumption compared to an earlier design [1]. Furthermore, due to the fully symmetrical structure of the sensor the sensitive directions are exactly orthogonal to each other and have near identical sensitivity, thus requiring no individual calibration.",
keywords = "EWI-26761, IR-99322, METIS-315574, TST-Life like",
author = "O. Pjetri and Wiegerink, {Remco J.} and Krijnen, {Gijsbertus J.M.}",
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Pjetri, O, Wiegerink, RJ & Krijnen, GJM 2015, A 2D particle velocity sensor with minimal flow-disturbance. in Proceedings IEEE Sensors 2015. IEEE, Piscataway, pp. 1307-1310, 2015 IEEE Sensors, Busan, Korea, Republic of, 1/11/15. https://doi.org/10.1109/ICSENS.2015.7370512

A 2D particle velocity sensor with minimal flow-disturbance. / Pjetri, O.; Wiegerink, Remco J.; Krijnen, Gijsbertus J.M.

Proceedings IEEE Sensors 2015. Piscataway : IEEE, 2015. p. 1307-1310.

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

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N2 - A 2D sound particle velocity sensor, consisting of a cross of two connected, heated wires is presented. We developed a fabrication process by which the wires become freely suspended 350 μm above the chip surface. This largely eliminates the influence of boundary layer effects and increases the temperature gradient along the wires, both due to the large distance to the silicon substrate. As a result, the sensor has increased sensitivity and reduced power consumption compared to an earlier design [1]. Furthermore, due to the fully symmetrical structure of the sensor the sensitive directions are exactly orthogonal to each other and have near identical sensitivity, thus requiring no individual calibration.

AB - A 2D sound particle velocity sensor, consisting of a cross of two connected, heated wires is presented. We developed a fabrication process by which the wires become freely suspended 350 μm above the chip surface. This largely eliminates the influence of boundary layer effects and increases the temperature gradient along the wires, both due to the large distance to the silicon substrate. As a result, the sensor has increased sensitivity and reduced power consumption compared to an earlier design [1]. Furthermore, due to the fully symmetrical structure of the sensor the sensitive directions are exactly orthogonal to each other and have near identical sensitivity, thus requiring no individual calibration.

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