Abstract
Abstract—Global on-chip data communication is becoming a
concern as the gap between transistor speed and interconnect
bandwidth increases with CMOS process scaling. Repeaters can
partly bridge this gap, but the classical repeater insertion approach
requires a large number of repeaters while the intrinsic data capacity
of each interconnect-segment is only partially used. In this
paper we analyze interconnects and show how a combination of
layout, termination and equalization techniques can significantly
increase the data rate for a given length of uninterrupted interconnect.
To validate these techniques, a bus-transceiver test chip in a
0.13- m, 1.2-V, 6-M copper CMOS process has been designed. The
chip uses 10-mm-long differential interconnects with wire widths
and spacing of only 0.4 m. Differential interconnects are insensitive
to common-mode disturbances (e.g., non-neighbor crosstalk)
and enable the use of twists to mitigate neighbor-to-neighbor
crosstalk. With transceivers operating in conventional mode, the
chip achieves only 0.55 Gb/s/ch. The achievable data rate increases
to 3 Gb/s/ch (consuming 2 pJ/bit) with a pulse-width pre-emphasis
technique, used in combination with resistive termination.
Original language | English |
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Pages (from-to) | 297-306 |
Number of pages | 10 |
Journal | IEEE journal of solid-state circuits |
Volume | 41 |
Issue number | 1 |
DOIs | |
Publication status | Published - 1 Jan 2006 |
Keywords
- ICD-CMOS NANO-WIRE COMMUNICATION
- IR-57310
- METIS-238061
- EWI-3763