A Bond-Graph Metamodel: Physics-Based Interconnection of Software Components

Reynaldo  Cobos Mendez; Julio de Oliveira Filho; Douwe  Dresscher; Jan Broenink

doi:10.1007/978-3-030-40914-2_5

A Bond-Graph Metamodel: Physics-Based Interconnection of Software Components

Reynaldo Cobos Mendez, Julio de Oliveira Filho, Douwe Dresscher, Jan Broenink

Robotics and Mechatronics

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

3 Citations (Scopus)

56 Downloads (Pure)

Abstract

Composability and modularity in relation to physics are useful properties in the development of cyber-physical systems that interact with their environment. The bond-graph modeling language offers these properties. When systems structures conform to the bond-graph notation, all interfaces are defined as physical “power ports” which are guaranteed to exchange power. Having a single type of interface is a key feature when aiming for modular, composable systems. Furthermore, the facility to monitor energy flows in the system through power ports allows the definition of system-wide properties based on component properties. In this paper we present a metamodel of the bond-graph language aimed to facilitate the description and deployment of software components for cyber-physical systems. This effort provides a formalized description of standardized interfaces that enable physics-conformal interconnections. We present a use-case showing that the metamodel enables composability, reusability, extensibility, replaceability and independence of control software components.

Original language	English
Title of host publication	Formal Aspects of Component Software
Subtitle of host publication	16th International Conference, FACS 2019, Amsterdam, The Netherlands, October 23–25, 2019, Proceedings
Editors	Farhad Arbab, Sung-Shik Jongmans
Place of Publication	Cham
Publisher	Springer
Pages	87-105
Number of pages	19
ISBN (Electronic)	978-3-030-40914-2
ISBN (Print)	978-3-030-40913-5
DOIs	https://doi.org/10.1007/978-3-030-40914-2_5
Publication status	Published - 13 Feb 2020
Event	16th International Conference on Formal Aspects of Component Software 2019 - Science Park Amsterdam, Amsterdam, Netherlands Duration: 23 Oct 2019 → 25 Oct 2019 Conference number: 16 http://facs2019.org/

Publication series

Name	Lecture Notes in Computer Science
Publisher	Springer
Volume	12018
ISSN (Print)	0302-9743
ISSN (Electronic)	1611-3349

Conference

Conference	16th International Conference on Formal Aspects of Component Software 2019
Abbreviated title	FACS 2019
Country/Territory	Netherlands
City	Amsterdam
Period	23/10/19 → 25/10/19
Internet address	http://facs2019.org/

Keywords

Bond-graph
Metamodeling
Power port
Component software
Cyber-physical systems
22/2 OA procedure

Access to Document

10.1007/978-3-030-40914-2_5

Cobos-Méndez2020Bond-GraphFinal published version, 1.13 MBLicence: Taverne

Cite this

Cobos Mendez, R., de Oliveira Filho, J., Dresscher, D., & Broenink, J. (2020). A Bond-Graph Metamodel: Physics-Based Interconnection of Software Components. In F. Arbab, & S-S. Jongmans (Eds.), Formal Aspects of Component Software: 16th International Conference, FACS 2019, Amsterdam, The Netherlands, October 23–25, 2019, Proceedings (pp. 87-105). (Lecture Notes in Computer Science; Vol. 12018). Springer. https://doi.org/10.1007/978-3-030-40914-2_5

Cobos Mendez, Reynaldo ; de Oliveira Filho, Julio ; Dresscher, Douwe et al. / A Bond-Graph Metamodel : Physics-Based Interconnection of Software Components. Formal Aspects of Component Software: 16th International Conference, FACS 2019, Amsterdam, The Netherlands, October 23–25, 2019, Proceedings. editor / Farhad Arbab ; Sung-Shik Jongmans. Cham : Springer, 2020. pp. 87-105 (Lecture Notes in Computer Science).

@inproceedings{e7da1340b55f4ab0abccbc05c9b96ea7,

title = "A Bond-Graph Metamodel: Physics-Based Interconnection of Software Components",

abstract = "Composability and modularity in relation to physics are useful properties in the development of cyber-physical systems that interact with their environment. The bond-graph modeling language offers these properties. When systems structures conform to the bond-graph notation, all interfaces are defined as physical “power ports” which are guaranteed to exchange power. Having a single type of interface is a key feature when aiming for modular, composable systems. Furthermore, the facility to monitor energy flows in the system through power ports allows the definition of system-wide properties based on component properties. In this paper we present a metamodel of the bond-graph language aimed to facilitate the description and deployment of software components for cyber-physical systems. This effort provides a formalized description of standardized interfaces that enable physics-conformal interconnections. We present a use-case showing that the metamodel enables composability, reusability, extensibility, replaceability and independence of control software components.",

keywords = "Bond-graph, Metamodeling, Power port, Component software, Cyber-physical systems, 22/2 OA procedure",

author = "{Cobos Mendez}, Reynaldo and {de Oliveira Filho}, Julio and Douwe Dresscher and Jan Broenink",

year = "2020",

month = feb,

day = "13",

doi = "10.1007/978-3-030-40914-2_5",

language = "English",

isbn = "978-3-030-40913-5",

series = "Lecture Notes in Computer Science",

publisher = "Springer",

pages = "87--105",

editor = "Farhad Arbab and Sung-Shik Jongmans",

booktitle = "Formal Aspects of Component Software",

note = "16th International Conference on Formal Aspects of Component Software 2019, FACS 2019 ; Conference date: 23-10-2019 Through 25-10-2019",

url = "http://facs2019.org/",

}

Cobos Mendez, R, de Oliveira Filho, J, Dresscher, D & Broenink, J 2020, A Bond-Graph Metamodel: Physics-Based Interconnection of Software Components. in F Arbab & S-S Jongmans (eds), Formal Aspects of Component Software: 16th International Conference, FACS 2019, Amsterdam, The Netherlands, October 23–25, 2019, Proceedings. Lecture Notes in Computer Science, vol. 12018, Springer, Cham, pp. 87-105, 16th International Conference on Formal Aspects of Component Software 2019, Amsterdam, Netherlands, 23/10/19. https://doi.org/10.1007/978-3-030-40914-2_5

A Bond-Graph Metamodel: Physics-Based Interconnection of Software Components. / Cobos Mendez, Reynaldo ; de Oliveira Filho, Julio; Dresscher, Douwe et al.
Formal Aspects of Component Software: 16th International Conference, FACS 2019, Amsterdam, The Netherlands, October 23–25, 2019, Proceedings. ed. / Farhad Arbab; Sung-Shik Jongmans. Cham: Springer, 2020. p. 87-105 (Lecture Notes in Computer Science; Vol. 12018).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - A Bond-Graph Metamodel

T2 - 16th International Conference on Formal Aspects of Component Software 2019

AU - Cobos Mendez, Reynaldo

AU - de Oliveira Filho, Julio

AU - Dresscher, Douwe

AU - Broenink, Jan

N1 - Conference code: 16

PY - 2020/2/13

Y1 - 2020/2/13

N2 - Composability and modularity in relation to physics are useful properties in the development of cyber-physical systems that interact with their environment. The bond-graph modeling language offers these properties. When systems structures conform to the bond-graph notation, all interfaces are defined as physical “power ports” which are guaranteed to exchange power. Having a single type of interface is a key feature when aiming for modular, composable systems. Furthermore, the facility to monitor energy flows in the system through power ports allows the definition of system-wide properties based on component properties. In this paper we present a metamodel of the bond-graph language aimed to facilitate the description and deployment of software components for cyber-physical systems. This effort provides a formalized description of standardized interfaces that enable physics-conformal interconnections. We present a use-case showing that the metamodel enables composability, reusability, extensibility, replaceability and independence of control software components.

AB - Composability and modularity in relation to physics are useful properties in the development of cyber-physical systems that interact with their environment. The bond-graph modeling language offers these properties. When systems structures conform to the bond-graph notation, all interfaces are defined as physical “power ports” which are guaranteed to exchange power. Having a single type of interface is a key feature when aiming for modular, composable systems. Furthermore, the facility to monitor energy flows in the system through power ports allows the definition of system-wide properties based on component properties. In this paper we present a metamodel of the bond-graph language aimed to facilitate the description and deployment of software components for cyber-physical systems. This effort provides a formalized description of standardized interfaces that enable physics-conformal interconnections. We present a use-case showing that the metamodel enables composability, reusability, extensibility, replaceability and independence of control software components.

KW - Bond-graph

KW - Metamodeling

KW - Power port

KW - Component software

KW - Cyber-physical systems

KW - 22/2 OA procedure

U2 - 10.1007/978-3-030-40914-2_5

DO - 10.1007/978-3-030-40914-2_5

M3 - Conference contribution

SN - 978-3-030-40913-5

T3 - Lecture Notes in Computer Science

SP - 87

EP - 105

BT - Formal Aspects of Component Software

A2 - Arbab, Farhad

A2 - Jongmans, Sung-Shik

PB - Springer

CY - Cham

Y2 - 23 October 2019 through 25 October 2019

ER -

Cobos Mendez R, de Oliveira Filho J, Dresscher D , Broenink J. A Bond-Graph Metamodel: Physics-Based Interconnection of Software Components. In Arbab F, Jongmans S-S, editors, Formal Aspects of Component Software: 16th International Conference, FACS 2019, Amsterdam, The Netherlands, October 23–25, 2019, Proceedings. Cham: Springer. 2020. p. 87-105. (Lecture Notes in Computer Science). doi: 10.1007/978-3-030-40914-2_5

A Bond-Graph Metamodel: Physics-Based Interconnection of Software Components

Abstract

Publication series

Conference

Keywords

Access to Document

Fingerprint

Cite this