Two commercially available silver inks were inkjet printed to fabricate the seed tracks (seed layers) of radio frequency (RF) circuit structures on a high frequency substrate material. One of them is a nanoparticle based ink, and the other, a non-particle based organic silver complex ink. Subsequent to printing, these seed layers were copper plated using an electroless copper plating process, to impart the desired thickness to the circuit structures. The inkjet printing-electroless plating process combination was validated with the example of an S-band filter and an RF transmission line. Prior to the fabrication of the circuit structures, the substrates were plasma treated, in order to modify their surface and promote mechanical interlocking with the printed structures. Finally, experiments were conducted to determine the solderability of inkjet printed as well as printed-plated structures. Conclusions on the suitability of the two inks for RF circuit fabrication have been drawn based on experimental results.
|Number of pages||5|
|Publication status||Published - 2009|