A comparative study of two conductive inkjet inks for fabrication of RF circuit structures

Ashok Sridhar, D.J. van Dijk, Remko Akkerman

Research output: Contribution to conferencePaper

33 Downloads (Pure)

Abstract

Two commercially available silver inks were inkjet printed to fabricate the seed tracks (seed layers) of radio frequency (RF) circuit structures on a high frequency substrate material. One of them is a nanoparticle based ink, and the other, a non-particle based organic silver complex ink. Subsequent to printing, these seed layers were copper plated using an electroless copper plating process, to impart the desired thickness to the circuit structures. The inkjet printing-electroless plating process combination was validated with the example of an S-band filter and an RF transmission line. Prior to the fabrication of the circuit structures, the substrates were plasma treated, in order to modify their surface and promote mechanical interlocking with the printed structures. Finally, experiments were conducted to determine the solderability of inkjet printed as well as printed-plated structures. Conclusions on the suitability of the two inks for RF circuit fabrication have been drawn based on experimental results.
Original languageUndefined
Number of pages5
Publication statusPublished - 2009

Keywords

  • IR-75480

Cite this

@conference{56188e35112a41928b0691b40db9771c,
title = "A comparative study of two conductive inkjet inks for fabrication of RF circuit structures",
abstract = "Two commercially available silver inks were inkjet printed to fabricate the seed tracks (seed layers) of radio frequency (RF) circuit structures on a high frequency substrate material. One of them is a nanoparticle based ink, and the other, a non-particle based organic silver complex ink. Subsequent to printing, these seed layers were copper plated using an electroless copper plating process, to impart the desired thickness to the circuit structures. The inkjet printing-electroless plating process combination was validated with the example of an S-band filter and an RF transmission line. Prior to the fabrication of the circuit structures, the substrates were plasma treated, in order to modify their surface and promote mechanical interlocking with the printed structures. Finally, experiments were conducted to determine the solderability of inkjet printed as well as printed-plated structures. Conclusions on the suitability of the two inks for RF circuit fabrication have been drawn based on experimental results.",
keywords = "IR-75480",
author = "Ashok Sridhar and {van Dijk}, D.J. and Remko Akkerman",
year = "2009",
language = "Undefined",

}

A comparative study of two conductive inkjet inks for fabrication of RF circuit structures. / Sridhar, Ashok; van Dijk, D.J.; Akkerman, Remko.

2009.

Research output: Contribution to conferencePaper

TY - CONF

T1 - A comparative study of two conductive inkjet inks for fabrication of RF circuit structures

AU - Sridhar, Ashok

AU - van Dijk, D.J.

AU - Akkerman, Remko

PY - 2009

Y1 - 2009

N2 - Two commercially available silver inks were inkjet printed to fabricate the seed tracks (seed layers) of radio frequency (RF) circuit structures on a high frequency substrate material. One of them is a nanoparticle based ink, and the other, a non-particle based organic silver complex ink. Subsequent to printing, these seed layers were copper plated using an electroless copper plating process, to impart the desired thickness to the circuit structures. The inkjet printing-electroless plating process combination was validated with the example of an S-band filter and an RF transmission line. Prior to the fabrication of the circuit structures, the substrates were plasma treated, in order to modify their surface and promote mechanical interlocking with the printed structures. Finally, experiments were conducted to determine the solderability of inkjet printed as well as printed-plated structures. Conclusions on the suitability of the two inks for RF circuit fabrication have been drawn based on experimental results.

AB - Two commercially available silver inks were inkjet printed to fabricate the seed tracks (seed layers) of radio frequency (RF) circuit structures on a high frequency substrate material. One of them is a nanoparticle based ink, and the other, a non-particle based organic silver complex ink. Subsequent to printing, these seed layers were copper plated using an electroless copper plating process, to impart the desired thickness to the circuit structures. The inkjet printing-electroless plating process combination was validated with the example of an S-band filter and an RF transmission line. Prior to the fabrication of the circuit structures, the substrates were plasma treated, in order to modify their surface and promote mechanical interlocking with the printed structures. Finally, experiments were conducted to determine the solderability of inkjet printed as well as printed-plated structures. Conclusions on the suitability of the two inks for RF circuit fabrication have been drawn based on experimental results.

KW - IR-75480

M3 - Paper

ER -