A complete three-dimensional sound intensity sensor integrated on a single chip

Research output: Contribution to journalArticleAcademicpeer-review

7 Citations (Scopus)

Abstract

Complete characterization of a sound field requires measurement of both sound pressure and particle velocity. In this paper, we present a three-dimensional acoustic particle velocity sensor chip. Furthermore, a sound pressure sensor was integrated on the same chip, enabling three-dimensional sound intensity measurements. The integration of multiple sensors on a single silicon chip results in highly reproducible sensors and a very small sensor-to-sensor distance allowing for accurate single-point measurements. The latter is demonstrated by measurement of the 3D particle velocity field of a very small (1 × 1 mm2) sound source.
Original languageUndefined
Article number10.1088/0960-1317/18/11/115004
Pages (from-to)1-9
Number of pages9
JournalJournal of micromechanics and microengineering
Volume18
Issue number2008/16200/11
DOIs
Publication statusPublished - 23 Sep 2008

Keywords

  • EWI-14706
  • IR-62641
  • METIS-255043
  • TST-SENSORS

Cite this

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title = "A complete three-dimensional sound intensity sensor integrated on a single chip",
abstract = "Complete characterization of a sound field requires measurement of both sound pressure and particle velocity. In this paper, we present a three-dimensional acoustic particle velocity sensor chip. Furthermore, a sound pressure sensor was integrated on the same chip, enabling three-dimensional sound intensity measurements. The integration of multiple sensors on a single silicon chip results in highly reproducible sensors and a very small sensor-to-sensor distance allowing for accurate single-point measurements. The latter is demonstrated by measurement of the 3D particle velocity field of a very small (1 × 1 mm2) sound source.",
keywords = "EWI-14706, IR-62641, METIS-255043, TST-SENSORS",
author = "Yntema, {Doekle Reinder} and {van Honschoten}, J.W. and Wiegerink, {Remco J.} and Elwenspoek, {Michael Curt}",
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A complete three-dimensional sound intensity sensor integrated on a single chip. / Yntema, Doekle Reinder; van Honschoten, J.W.; Wiegerink, Remco J.; Elwenspoek, Michael Curt.

In: Journal of micromechanics and microengineering, Vol. 18, No. 2008/16200/11, 10.1088/0960-1317/18/11/115004, 23.09.2008, p. 1-9.

Research output: Contribution to journalArticleAcademicpeer-review

TY - JOUR

T1 - A complete three-dimensional sound intensity sensor integrated on a single chip

AU - Yntema, Doekle Reinder

AU - van Honschoten, J.W.

AU - Wiegerink, Remco J.

AU - Elwenspoek, Michael Curt

N1 - 10.1088/0960-1317/18/11/115004

PY - 2008/9/23

Y1 - 2008/9/23

N2 - Complete characterization of a sound field requires measurement of both sound pressure and particle velocity. In this paper, we present a three-dimensional acoustic particle velocity sensor chip. Furthermore, a sound pressure sensor was integrated on the same chip, enabling three-dimensional sound intensity measurements. The integration of multiple sensors on a single silicon chip results in highly reproducible sensors and a very small sensor-to-sensor distance allowing for accurate single-point measurements. The latter is demonstrated by measurement of the 3D particle velocity field of a very small (1 × 1 mm2) sound source.

AB - Complete characterization of a sound field requires measurement of both sound pressure and particle velocity. In this paper, we present a three-dimensional acoustic particle velocity sensor chip. Furthermore, a sound pressure sensor was integrated on the same chip, enabling three-dimensional sound intensity measurements. The integration of multiple sensors on a single silicon chip results in highly reproducible sensors and a very small sensor-to-sensor distance allowing for accurate single-point measurements. The latter is demonstrated by measurement of the 3D particle velocity field of a very small (1 × 1 mm2) sound source.

KW - EWI-14706

KW - IR-62641

KW - METIS-255043

KW - TST-SENSORS

U2 - 10.1088/0960-1317/18/11/115004

DO - 10.1088/0960-1317/18/11/115004

M3 - Article

VL - 18

SP - 1

EP - 9

JO - Journal of micromechanics and microengineering

JF - Journal of micromechanics and microengineering

SN - 0960-1317

IS - 2008/16200/11

M1 - 10.1088/0960-1317/18/11/115004

ER -