A contact model for sticking of adhesive mesoscopic particles

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

Original languageEnglish
Title of host publicationProceedings of the 9th European Solid Mechanics Conference, ESMC 2015
Place of PublicationMadrid, Spain
Pages-
Publication statusPublished - 6 Jul 2016

Keywords

  • IR-101618
  • METIS-312763

Cite this

Singh, A., Magnanimo, V., & Luding, S. (2016). A contact model for sticking of adhesive mesoscopic particles. In Proceedings of the 9th European Solid Mechanics Conference, ESMC 2015 (pp. -). Madrid, Spain.