A cost analysis study of deposited-MCM active substrates for testability purposes

J. Oliver; H. Kerkhoff

doi:10.1109/MCMC.1996.510773

A cost analysis study of deposited-MCM active substrates for testability purposes

J. Oliver
, H. Kerkhoff

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

Abstract

MultiChip Modules (MCMs) are seen as a future powerful integration methodology for systems manufacturing. However, MCM testing has become one of the most challenging problem we will have to face in the next few years. In order to find cost effective solutions to the test of MCMs, test structures on active substrate must be considered. In this way, this paper presents cost analysis results based on yield calculations of test structures placed on active substrates.

Original language	English
Title of host publication	Proceedings 1996 IEEE Multi-Chip Module Conference
Subtitle of host publication	6-7 February 1996, Santa Cruz, CA, USA
Place of Publication	Piscataway, NJ
Publisher	IEEE
Pages	80-85
ISBN (Print)	0-8186-7286-2
DOIs	https://doi.org/10.1109/MCMC.1996.510773
Publication status	Published - 4 Feb 1996
Event	IEEE Multi-Chip Module Conference, MCMC 1996 - Santa Cruz, United States Duration: 6 Feb 1996 → 7 Feb 1996 https://www.computer.org/csdl/proceedings/mcmc/1996/12OmNArbG48

Conference

Conference	IEEE Multi-Chip Module Conference, MCMC 1996
Abbreviated title	MCMC'96
Country/Territory	United States
City	Santa Cruz
Period	6/02/96 → 7/02/96
Internet address	https://www.computer.org/csdl/proceedings/mcmc/1996/12OmNArbG48

Keywords

Costs
Circuit testing
Integrated circuit packaging
Integrated circuit interconnections
Integrated circuit testing
Automatic testing
Multichip modules
Manufacturing
Capacitance
Integrated circuit technology

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

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10.1109/MCMC.1996.510773

ArticleFinal published version, 680 KB

Cite this

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title = "A cost analysis study of deposited-MCM active substrates for testability purposes",

abstract = "MultiChip Modules (MCMs) are seen as a future powerful integration methodology for systems manufacturing. However, MCM testing has become one of the most challenging problem we will have to face in the next few years. In order to find cost effective solutions to the test of MCMs, test structures on active substrate must be considered. In this way, this paper presents cost analysis results based on yield calculations of test structures placed on active substrates.",

keywords = "Costs, Circuit testing, Integrated circuit packaging, Integrated circuit interconnections, Integrated circuit testing, Automatic testing, Multichip modules, Manufacturing, Capacitance, Integrated circuit technology",

author = "J. Oliver and H. Kerkhoff",

year = "1996",

month = feb,

day = "4",

doi = "10.1109/MCMC.1996.510773",

language = "English",

isbn = "0-8186-7286-2",

pages = "80--85",

booktitle = "Proceedings 1996 IEEE Multi-Chip Module Conference",

publisher = "IEEE",

address = "United States",

note = "IEEE Multi-Chip Module Conference, MCMC 1996, MCMC'96 ; Conference date: 06-02-1996 Through 07-02-1996",

url = "https://www.computer.org/csdl/proceedings/mcmc/1996/12OmNArbG48",

}

Oliver, J & Kerkhoff, H 1996, A cost analysis study of deposited-MCM active substrates for testability purposes. in Proceedings 1996 IEEE Multi-Chip Module Conference: 6-7 February 1996, Santa Cruz, CA, USA. IEEE, Piscataway, NJ, pp. 80-85, IEEE Multi-Chip Module Conference, MCMC 1996, Santa Cruz, California, United States, 6/02/96. https://doi.org/10.1109/MCMC.1996.510773

TY - GEN

T1 - A cost analysis study of deposited-MCM active substrates for testability purposes

AU - Oliver, J.

AU - Kerkhoff, H.

PY - 1996/2/4

Y1 - 1996/2/4

N2 - MultiChip Modules (MCMs) are seen as a future powerful integration methodology for systems manufacturing. However, MCM testing has become one of the most challenging problem we will have to face in the next few years. In order to find cost effective solutions to the test of MCMs, test structures on active substrate must be considered. In this way, this paper presents cost analysis results based on yield calculations of test structures placed on active substrates.

AB - MultiChip Modules (MCMs) are seen as a future powerful integration methodology for systems manufacturing. However, MCM testing has become one of the most challenging problem we will have to face in the next few years. In order to find cost effective solutions to the test of MCMs, test structures on active substrate must be considered. In this way, this paper presents cost analysis results based on yield calculations of test structures placed on active substrates.

KW - Costs

KW - Circuit testing

KW - Integrated circuit packaging

KW - Integrated circuit interconnections

KW - Integrated circuit testing

KW - Automatic testing

KW - Multichip modules

KW - Manufacturing

KW - Capacitance

KW - Integrated circuit technology

U2 - 10.1109/MCMC.1996.510773

DO - 10.1109/MCMC.1996.510773

M3 - Conference contribution

SN - 0-8186-7286-2

SP - 80

EP - 85

BT - Proceedings 1996 IEEE Multi-Chip Module Conference

PB - IEEE

CY - Piscataway, NJ

T2 - IEEE Multi-Chip Module Conference, MCMC 1996

Y2 - 6 February 1996 through 7 February 1996

ER -

A cost analysis study of deposited-MCM active substrates for testability purposes

Abstract

Conference

Keywords

UN SDGs

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