A Generic Processor Temperature Estimation Method

Baver Ozceylan*, Boudewijn Remigius Heinrich Maria Haverkort, Maurits de Graaf, Marco E. T. Gerards

*Corresponding author for this work

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Abstract

Most modern mobile embedded devices have the ability to increase their computational power typically at the cost of increased heat dissipation. This may result in temperatures above the design limit, especially if active cooling is inapplicable. Thus, it is necessary to consider processor temperature while scheduling tasks. This means estimating the change in temperature due to changed workload is crucial for high performance mobile embedded devices. To address this challenge, we first introduce a model to estimate the temperature and classify the system dependent model parameters. Then, to determine these parameters, we develop a new method, which can be applied on any mobile embedded device. The only requirement for our new method is learning the device characteristics by processing a certain task while recording the temperature with built-in sensors. Our results show that our method can achieve high accuracy within a short testing period.
Original languageEnglish
Title of host publication2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
EditorsMarta Rencz, Lorenzo Codecasa, Andras Poppe
PublisherIEEE
Number of pages6
ISBN (Print)978-1-7281-2078-2
DOIs
Publication statusPublished - 5 Dec 2019
Event25th International Workshop on Thermal Investigations of ICs and Systems 2019: THERMINIC 2019 - University of Milano, Lecco, Italy
Duration: 25 Sep 201927 Aug 2020
Conference number: 25
https://therminic2019.eu/

Workshop

Workshop25th International Workshop on Thermal Investigations of ICs and Systems 2019
Abbreviated titleTHERMINIC 2019
CountryItaly
CityLecco
Period25/09/1927/08/20
Internet address

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Cite this

Ozceylan, B., Haverkort, B. R. H. M., de Graaf, M., & Gerards, M. E. T. (2019). A Generic Processor Temperature Estimation Method. In M. Rencz, L. Codecasa, & A. Poppe (Eds.), 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) IEEE. https://doi.org/10.1109/THERMINIC.2019.8923636