A Generic Processor Temperature Estimation Method

Baver  Ozceylan; Boudewijn Remigius Heinrich Maria Haverkort; Maurits  de Graaf; Marco E. T. Gerards

doi:10.1109/THERMINIC.2019.8923636

A Generic Processor Temperature Estimation Method

Baver Ozceylan^*, Boudewijn Remigius Heinrich Maria Haverkort, Maurits de Graaf, Marco E. T. Gerards

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

4 Citations (Scopus)

11 Downloads (Pure)

Abstract

Most modern mobile embedded devices have the ability to increase their computational power typically at the cost of increased heat dissipation. This may result in temperatures above the design limit, especially if active cooling is inapplicable. Thus, it is necessary to consider processor temperature while scheduling tasks. This means estimating the change in temperature due to changed workload is crucial for high performance mobile embedded devices. To address this challenge, we first introduce a model to estimate the temperature and classify the system dependent model parameters. Then, to determine these parameters, we develop a new method, which can be applied on any mobile embedded device. The only requirement for our new method is learning the device characteristics by processing a certain task while recording the temperature with built-in sensors. Our results show that our method can achieve high accuracy within a short testing period.

Original language	English
Title of host publication	2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Editors	Marta Rencz, Lorenzo Codecasa, Andras Poppe
Publisher	IEEE
Number of pages	6
ISBN (Electronic)	978-1-7281-2078-2
ISBN (Print)	978-1-7281-2079-9
DOIs	https://doi.org/10.1109/THERMINIC.2019.8923636
Publication status	Published - 5 Dec 2019
Event	25th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2019 - University of Milano, Lecco, Italy Duration: 24 Sept 2020 → 24 Sept 2020 Conference number: 25 https://therminic2019.eu/

Workshop

Workshop	25th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2019
Abbreviated title	THERMINIC
Country/Territory	Italy
City	Lecco
Period	24/09/20 → 24/09/20
Internet address	https://therminic2019.eu/

Access to Document

10.1109/THERMINIC.2019.8923636

2019 Harvey Rosten Award For Excellence
Ozceylan, B. (Recipient), Haverkort, B. R. H. M. (Recipient), de Graaf, M. (Recipient) & Gerards, M. E. T. (Recipient), 19 Mar 2020
Prize

Cite this

@inproceedings{2f49e6da60b846f0aa8d83c05f5882d2,

title = "A Generic Processor Temperature Estimation Method",

abstract = "Most modern mobile embedded devices have the ability to increase their computational power typically at the cost of increased heat dissipation. This may result in temperatures above the design limit, especially if active cooling is inapplicable. Thus, it is necessary to consider processor temperature while scheduling tasks. This means estimating the change in temperature due to changed workload is crucial for high performance mobile embedded devices. To address this challenge, we first introduce a model to estimate the temperature and classify the system dependent model parameters. Then, to determine these parameters, we develop a new method, which can be applied on any mobile embedded device. The only requirement for our new method is learning the device characteristics by processing a certain task while recording the temperature with built-in sensors. Our results show that our method can achieve high accuracy within a short testing period.",

author = "Baver Ozceylan and Haverkort, {Boudewijn Remigius Heinrich Maria} and {de Graaf}, Maurits and Gerards, {Marco E. T.}",

year = "2019",

month = dec,

day = "5",

doi = "10.1109/THERMINIC.2019.8923636",

language = "English",

isbn = "978-1-7281-2079-9",

editor = "Marta Rencz and Lorenzo Codecasa and Andras Poppe",

booktitle = "2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)",

publisher = "IEEE",

address = "United States",

note = "25th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2019, THERMINIC ; Conference date: 24-09-2020 Through 24-09-2020",

url = "https://therminic2019.eu/",

}

Ozceylan, B, Haverkort, BRHM, de Graaf, M & Gerards, MET 2019, A Generic Processor Temperature Estimation Method. in M Rencz, L Codecasa & A Poppe (eds), 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)., 8923636, IEEE, 25th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2019, Lecco, Italy, 24/09/20. https://doi.org/10.1109/THERMINIC.2019.8923636

A Generic Processor Temperature Estimation Method. / Ozceylan, Baver ; Haverkort, Boudewijn Remigius Heinrich Maria; de Graaf, Maurits et al.
2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). ed. / Marta Rencz; Lorenzo Codecasa; Andras Poppe. IEEE, 2019. 8923636.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - A Generic Processor Temperature Estimation Method

AU - Ozceylan, Baver

AU - Haverkort, Boudewijn Remigius Heinrich Maria

AU - de Graaf, Maurits

AU - Gerards, Marco E. T.

N1 - Conference code: 25

PY - 2019/12/5

Y1 - 2019/12/5

N2 - Most modern mobile embedded devices have the ability to increase their computational power typically at the cost of increased heat dissipation. This may result in temperatures above the design limit, especially if active cooling is inapplicable. Thus, it is necessary to consider processor temperature while scheduling tasks. This means estimating the change in temperature due to changed workload is crucial for high performance mobile embedded devices. To address this challenge, we first introduce a model to estimate the temperature and classify the system dependent model parameters. Then, to determine these parameters, we develop a new method, which can be applied on any mobile embedded device. The only requirement for our new method is learning the device characteristics by processing a certain task while recording the temperature with built-in sensors. Our results show that our method can achieve high accuracy within a short testing period.

AB - Most modern mobile embedded devices have the ability to increase their computational power typically at the cost of increased heat dissipation. This may result in temperatures above the design limit, especially if active cooling is inapplicable. Thus, it is necessary to consider processor temperature while scheduling tasks. This means estimating the change in temperature due to changed workload is crucial for high performance mobile embedded devices. To address this challenge, we first introduce a model to estimate the temperature and classify the system dependent model parameters. Then, to determine these parameters, we develop a new method, which can be applied on any mobile embedded device. The only requirement for our new method is learning the device characteristics by processing a certain task while recording the temperature with built-in sensors. Our results show that our method can achieve high accuracy within a short testing period.

U2 - 10.1109/THERMINIC.2019.8923636

DO - 10.1109/THERMINIC.2019.8923636

M3 - Conference contribution

SN - 978-1-7281-2079-9

BT - 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

A2 - Rencz, Marta

A2 - Codecasa, Lorenzo

A2 - Poppe, Andras

PB - IEEE

T2 - 25th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2019

Y2 - 24 September 2020 through 24 September 2020

ER -

A Generic Processor Temperature Estimation Method

Abstract

Workshop

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Prizes

2019 Harvey Rosten Award For Excellence

Cite this