A high-density inductively-coupled remote plasma system for the deposition of dielectrics and semiconductors

A.A.I. Aarnink, A. Boogaard, I. Brunets, I.G. Isai, Alexeij Y. Kovalgin, J. Holleman, R.A.M. Wolters, J. Schmitz

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic

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    Abstract

    We recently built an Inductively-Coupled Remote Plasma-Enhanced Chemical Vapor Deposition (ICPECVD) system for deposition of dielectric and semi-conducting layers at low substrate temperatures (~150
    Original languageEnglish
    Title of host publicationProceedings of 8th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors 2005
    Place of PublicationVeldhoven, The Netherlands
    PublisherSTW
    Pages67-69
    Number of pages3
    ISBN (Print)90-73461-50-2
    Publication statusPublished - 17 Nov 2005
    Event8th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors, SAFE 2005 - Veldhoven, Netherlands
    Duration: 17 Nov 2005 → 18 Nov 2005
    Conference number: 8

    Workshop

    Workshop8th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors, SAFE 2005
    Abbreviated titleSAFE
    CountryNetherlands
    CityVeldhoven
    Period17/11/05 → 18/11/05

    Keywords

    • Thin film
    • SC-CICC: Characterization of IC Components
    • high-density plasma
    • PECVD
    • ICRPECVD
    • ICPECVD
    • ALD
    • CVD

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      • Cite this

      Aarnink, A. A. I., Boogaard, A., Brunets, I., Isai, I. G., Kovalgin, A. Y., Holleman, J., ... Schmitz, J. (2005). A high-density inductively-coupled remote plasma system for the deposition of dielectrics and semiconductors. In Proceedings of 8th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors 2005 (pp. 67-69). Veldhoven, The Netherlands: STW.