A high-density inductively-coupled remote plasma system for the deposition of dielectrics and semiconductors

A.A.I. Aarnink; A. Boogaard; I. Brunets; I.G. Isai; Alexeij Y. Kovalgin; J. Holleman; R.A.M. Wolters; J. Schmitz

A high-density inductively-coupled remote plasma system for the deposition of dielectrics and semiconductors

A.A.I. Aarnink, A. Boogaard, I. Brunets, I.G. Isai, Alexeij Y. Kovalgin, J. Holleman, R.A.M. Wolters, J. Schmitz

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic

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Abstract

We recently built an Inductively-Coupled Remote Plasma-Enhanced Chemical Vapor Deposition (ICPECVD) system for deposition of dielectric and semi-conducting layers at low substrate temperatures (~150

Original language	English
Title of host publication	Proceedings of 8th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors 2005
Place of Publication	Veldhoven, The Netherlands
Publisher	STW
Pages	67-69
Number of pages	3
ISBN (Print)	90-73461-50-2
Publication status	Published - 17 Nov 2005
Event	8th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors, SAFE 2005 - Veldhoven, Netherlands Duration: 17 Nov 2005 → 18 Nov 2005 Conference number: 8

Workshop

Workshop	8th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors, SAFE 2005
Abbreviated title	SAFE
Country/Territory	Netherlands
City	Veldhoven
Period	17/11/05 → 18/11/05

Keywords

Thin film
SC-CICC: Characterization of IC Components
high-density plasma
PECVD
ICRPECVD
ICPECVD
ALD
CVD

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@inproceedings{fc774c5a8ba549a0832b747ac86a1dbe,

title = "A high-density inductively-coupled remote plasma system for the deposition of dielectrics and semiconductors",

abstract = "We recently built an Inductively-Coupled Remote Plasma-Enhanced Chemical Vapor Deposition (ICPECVD) system for deposition of dielectric and semi-conducting layers at low substrate temperatures (\textasciitilde{}150",

keywords = "Thin film, SC-CICC: Characterization of IC Components, high-density plasma, PECVD, ICRPECVD, ICPECVD, ALD, CVD",

author = "A.A.I. Aarnink and A. Boogaard and I. Brunets and I.G. Isai and Kovalgin, \{Alexeij Y.\} and J. Holleman and R.A.M. Wolters and J. Schmitz",

year = "2005",

month = nov,

day = "17",

language = "English",

isbn = "90-73461-50-2",

pages = "67--69",

booktitle = "Proceedings of 8th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors 2005",

publisher = "STW",

note = "8th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors, SAFE 2005, SAFE ; Conference date: 17-11-2005 Through 18-11-2005",

}

Aarnink, AAI, Boogaard, A, Brunets, I, Isai, IG, Kovalgin, AY, Holleman, J, Wolters, RAM & Schmitz, J 2005, A high-density inductively-coupled remote plasma system for the deposition of dielectrics and semiconductors. in Proceedings of 8th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors 2005. STW, Veldhoven, The Netherlands, pp. 67-69, 8th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors, SAFE 2005, Veldhoven, Netherlands, 17/11/05.

A high-density inductively-coupled remote plasma system for the deposition of dielectrics and semiconductors. / Aarnink, A.A.I.; Boogaard, A.; Brunets, I. et al.
Proceedings of 8th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors 2005. Veldhoven, The Netherlands: STW, 2005. p. 67-69.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic

TY - GEN

T1 - A high-density inductively-coupled remote plasma system for the deposition of dielectrics and semiconductors

AU - Aarnink, A.A.I.

AU - Boogaard, A.

AU - Brunets, I.

AU - Isai, I.G.

AU - Kovalgin, Alexeij Y.

AU - Holleman, J.

AU - Wolters, R.A.M.

AU - Schmitz, J.

N1 - Conference code: 8

PY - 2005/11/17

Y1 - 2005/11/17

N2 - We recently built an Inductively-Coupled Remote Plasma-Enhanced Chemical Vapor Deposition (ICPECVD) system for deposition of dielectric and semi-conducting layers at low substrate temperatures (~150

AB - We recently built an Inductively-Coupled Remote Plasma-Enhanced Chemical Vapor Deposition (ICPECVD) system for deposition of dielectric and semi-conducting layers at low substrate temperatures (~150

KW - Thin film

KW - SC-CICC: Characterization of IC Components

KW - high-density plasma

KW - PECVD

KW - ICRPECVD

KW - ICPECVD

KW - ALD

KW - CVD

M3 - Conference contribution

SN - 90-73461-50-2

SP - 67

EP - 69

BT - Proceedings of 8th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors 2005

PB - STW

CY - Veldhoven, The Netherlands

T2 - 8th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors, SAFE 2005

Y2 - 17 November 2005 through 18 November 2005

ER -

A high-density inductively-coupled remote plasma system for the deposition of dielectrics and semiconductors

Abstract

Workshop

Keywords

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