A high-density inductively-coupled remote plasma system for the deposition of dielectrics and semiconductors

A.A.I. Aarnink, A. Boogaard, I. Brunets, I.G. Isai, Alexeij Y. Kovalgin, J. Holleman, R.A.M. Wolters, J. Schmitz

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic

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    Abstract

    We recently built an Inductively-Coupled Remote Plasma-Enhanced Chemical Vapor Deposition (ICPECVD) system for deposition of dielectric and semi-conducting layers at low substrate temperatures (~150
    Original languageEnglish
    Title of host publicationProceedings of 8th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors 2005
    Place of PublicationVeldhoven, The Netherlands
    PublisherSTW
    Pages67-69
    Number of pages3
    ISBN (Print)90-73461-50-2
    Publication statusPublished - 17 Nov 2005
    Event8th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors, SAFE 2005 - Veldhoven, Netherlands
    Duration: 17 Nov 2005 → 18 Nov 2005
    Conference number: 8

    Workshop

    Workshop8th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors, SAFE 2005
    Abbreviated titleSAFE
    CountryNetherlands
    CityVeldhoven
    Period17/11/05 → 18/11/05

    Fingerprint

    vapor deposition
    conduction
    temperature

    Keywords

    • Thin film
    • SC-CICC: Characterization of IC Components
    • high-density plasma
    • PECVD
    • ICRPECVD
    • ICPECVD
    • ALD
    • CVD

    Cite this

    Aarnink, A. A. I., Boogaard, A., Brunets, I., Isai, I. G., Kovalgin, A. Y., Holleman, J., ... Schmitz, J. (2005). A high-density inductively-coupled remote plasma system for the deposition of dielectrics and semiconductors. In Proceedings of 8th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors 2005 (pp. 67-69). Veldhoven, The Netherlands: STW.
    Aarnink, A.A.I. ; Boogaard, A. ; Brunets, I. ; Isai, I.G. ; Kovalgin, Alexeij Y. ; Holleman, J. ; Wolters, R.A.M. ; Schmitz, J. / A high-density inductively-coupled remote plasma system for the deposition of dielectrics and semiconductors. Proceedings of 8th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors 2005. Veldhoven, The Netherlands : STW, 2005. pp. 67-69
    @inproceedings{fc774c5a8ba549a0832b747ac86a1dbe,
    title = "A high-density inductively-coupled remote plasma system for the deposition of dielectrics and semiconductors",
    abstract = "We recently built an Inductively-Coupled Remote Plasma-Enhanced Chemical Vapor Deposition (ICPECVD) system for deposition of dielectric and semi-conducting layers at low substrate temperatures (~150",
    keywords = "Thin film, SC-CICC: Characterization of IC Components, high-density plasma, PECVD, ICRPECVD, ICPECVD, ALD, CVD",
    author = "A.A.I. Aarnink and A. Boogaard and I. Brunets and I.G. Isai and Kovalgin, {Alexeij Y.} and J. Holleman and R.A.M. Wolters and J. Schmitz",
    year = "2005",
    month = "11",
    day = "17",
    language = "English",
    isbn = "90-73461-50-2",
    pages = "67--69",
    booktitle = "Proceedings of 8th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors 2005",
    publisher = "STW",

    }

    Aarnink, AAI, Boogaard, A, Brunets, I, Isai, IG, Kovalgin, AY, Holleman, J, Wolters, RAM & Schmitz, J 2005, A high-density inductively-coupled remote plasma system for the deposition of dielectrics and semiconductors. in Proceedings of 8th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors 2005. STW, Veldhoven, The Netherlands, pp. 67-69, 8th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors, SAFE 2005, Veldhoven, Netherlands, 17/11/05.

    A high-density inductively-coupled remote plasma system for the deposition of dielectrics and semiconductors. / Aarnink, A.A.I.; Boogaard, A.; Brunets, I.; Isai, I.G.; Kovalgin, Alexeij Y.; Holleman, J.; Wolters, R.A.M.; Schmitz, J.

    Proceedings of 8th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors 2005. Veldhoven, The Netherlands : STW, 2005. p. 67-69.

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic

    TY - GEN

    T1 - A high-density inductively-coupled remote plasma system for the deposition of dielectrics and semiconductors

    AU - Aarnink, A.A.I.

    AU - Boogaard, A.

    AU - Brunets, I.

    AU - Isai, I.G.

    AU - Kovalgin, Alexeij Y.

    AU - Holleman, J.

    AU - Wolters, R.A.M.

    AU - Schmitz, J.

    PY - 2005/11/17

    Y1 - 2005/11/17

    N2 - We recently built an Inductively-Coupled Remote Plasma-Enhanced Chemical Vapor Deposition (ICPECVD) system for deposition of dielectric and semi-conducting layers at low substrate temperatures (~150

    AB - We recently built an Inductively-Coupled Remote Plasma-Enhanced Chemical Vapor Deposition (ICPECVD) system for deposition of dielectric and semi-conducting layers at low substrate temperatures (~150

    KW - Thin film

    KW - SC-CICC: Characterization of IC Components

    KW - high-density plasma

    KW - PECVD

    KW - ICRPECVD

    KW - ICPECVD

    KW - ALD

    KW - CVD

    M3 - Conference contribution

    SN - 90-73461-50-2

    SP - 67

    EP - 69

    BT - Proceedings of 8th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors 2005

    PB - STW

    CY - Veldhoven, The Netherlands

    ER -

    Aarnink AAI, Boogaard A, Brunets I, Isai IG, Kovalgin AY, Holleman J et al. A high-density inductively-coupled remote plasma system for the deposition of dielectrics and semiconductors. In Proceedings of 8th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors 2005. Veldhoven, The Netherlands: STW. 2005. p. 67-69

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