A hydrogen separation module based on wafer-scale micromachined palladium-silver alloy membranes

D.H. Tong, F.C. Gielens, H.T.H. Hoang Thi Hanh, Johan W. Berenschot, Meint J. de Boer, Johannes G.E. Gardeniers, Henricus V. Jansen, W. Nijdam, C.J.M. van Rijn, Michael Curt Elwenspoek

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

4 Citations (Scopus)
244 Downloads (Pure)

Abstract

A thin but strong and defect free palladium-silver (Pd-Ag) alloy membrane is fabricated with a sequence of well-known thin film and micromachining techniques. A microfabrication process also creates a robust wafer-scale membrane module, which is easy to be integrated into a membrane holder to have gastight connections to the outer world. The microfabricated membranes have been tested to determine the mechanical strength, hydrogen permeability and hydrogen selectivity. The membranes have high mechanical strength and can withstand pressures up to 3 bars at room temperature. High flow rates of up to 3.6 mol H/sub 2//m/sup 2/.s have been measured with a minimal selectivity of 1500 for H/sub 2//He. The membranes survived operation at 450/spl deg/C, which is a temperature relevant for practical application in industry, for more than 1000 hours
Original languageUndefined
Title of host publication12th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2003
Place of PublicationUSA
PublisherIEEE
Pages1742-1745
Number of pages4
ISBN (Print)0-7803-7731-1
DOIs
Publication statusPublished - Jun 2003
Event12th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2003 - Boston, United States
Duration: 8 Jun 200312 Jun 2003
Conference number: 12

Publication series

Name
PublisherIEEE
Volume2

Conference

Conference12th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2003
Abbreviated titleTRANSDUCERS 2003
Country/TerritoryUnited States
CityBoston
Period8/06/0312/06/03

Keywords

  • IR-46305
  • EWI-11228
  • METIS-214520

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