The electrochemical vapor deposition (EVD) method is a very promising technique for making gas-tight dense solidelectrolyte films on porous substrates. In this paper, theoretical and experimental studies on the kinetics of the depositionof dense yttria-stabilized zirconia films on porous ceramic substrates by the EVD method are presented. The more systematictheoretical analysis is based on a model which takes into account pore diffusion, bulk electrochemical transport, andsurface charge-transfer reactions in the film growing process. The experimental work is focused on examining the effectsof the oxygen partial pressure and substrate pore dimension on the EVD film growth rates. In accordance with thetheoretical prediction, the pressure of oxygen source reactant (e.g., water vapor), the partial pressure of oxygen and substratepore dimension are very important in affecting the rate-limiting step and film growth rate of the EVD process. In thepresent experimental conditions (e.g., low pressure of oxygen source reactant and small substrate pore-size/thicknessratio), the diffusion of the oxygen source reactant in the substrate pore is found to be the rate-limiting step for the EVDprocess.
Lin, Y. S., de Haart, L. G. J., de Vries, K. J., & Burggraaf, A. J. (1990). A Kinetic Study of the Electrochemical Vapor Deposition of Solid Oxide Electrolyte Films on Porous Substrates. Journal of the Electrochemical Society, 137(12), 3960-3966. https://doi.org/10.1149/1.2086337