Abstract
A silicon capacitive force/torque sensor is designed and realized to be used for biomechanical applications and robotics. The sensor is able to measure the forces in three directions and two torques using four parallel capacitor plates and four comb-structures. Novel spring and lever structures are designed to separate the different force components and minimize mechanical crosstalk. The fabrication process is based on deep reactive ion etching on both sides of a single silicon-on-insulator wafer and uses only two masks making it a straight-forward and robust process. The sensor has a force range of 2 N in shear and normal direction and a torque range of more than 6 Nmm. It has a high sensitivity of 38 fF/N and 550 fF/N in shear and normal direction respectively.
Original language | English |
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Title of host publication | 27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014 |
Place of Publication | San Francisco |
Publisher | The Printing House, Inc. |
Pages | 680-683 |
Number of pages | 4 |
ISBN (Print) | 978-1-4799-3509-3 |
DOIs | |
Publication status | Published - 26 Jan 2014 |
Event | 27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014 - San Francisco, United States Duration: 26 Jan 2014 → 30 Jan 2014 Conference number: 27 |
Publication series
Name | |
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Publisher | The Printing House, Inc. |
Conference
Conference | 27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014 |
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Abbreviated title | MEMS |
Country/Territory | United States |
City | San Francisco |
Period | 26/01/14 → 30/01/14 |
Keywords
- METIS-304024
- IR-89829
- EWI-24583
- TST-SENSORS