A Large Range Multi-Axis Capacitive Force/Torque Sensor Realized in a Single SOI Wafer

Dennis Alveringh; Robert Anton Brookhuis; Remco J. Wiegerink; Gijsbertus J.M. Krijnen

doi:10.1109/MEMSYS.2014.6765732

A Large Range Multi-Axis Capacitive Force/Torque Sensor Realized in a Single SOI Wafer

Dennis Alveringh, Robert Anton Brookhuis, Remco J. Wiegerink, Gijsbertus J.M. Krijnen

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

10 Citations (Scopus)

13 Downloads (Pure)

Abstract

A silicon capacitive force/torque sensor is designed and realized to be used for biomechanical applications and robotics. The sensor is able to measure the forces in three directions and two torques using four parallel capacitor plates and four comb-structures. Novel spring and lever structures are designed to separate the different force components and minimize mechanical crosstalk. The fabrication process is based on deep reactive ion etching on both sides of a single silicon-on-insulator wafer and uses only two masks making it a straight-forward and robust process. The sensor has a force range of 2 N in shear and normal direction and a torque range of more than 6 Nmm. It has a high sensitivity of 38 fF/N and 550 fF/N in shear and normal direction respectively.

Original language	English
Title of host publication	27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014
Place of Publication	San Francisco
Publisher	The Printing House, Inc.
Pages	680-683
Number of pages	4
ISBN (Print)	978-1-4799-3509-3
DOIs	https://doi.org/10.1109/MEMSYS.2014.6765732
Publication status	Published - 26 Jan 2014
Event	27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014 - San Francisco, United States Duration: 26 Jan 2014 → 30 Jan 2014 Conference number: 27

Publication series

Name
Publisher	The Printing House, Inc.

Conference

Conference	27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014
Abbreviated title	MEMS
Country/Territory	United States
City	San Francisco
Period	26/01/14 → 30/01/14

Keywords

METIS-304024
IR-89829
EWI-24583
TST-SENSORS

Access to Document

10.1109/MEMSYS.2014.6765732

Cite this

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title = "A Large Range Multi-Axis Capacitive Force/Torque Sensor Realized in a Single SOI Wafer",

abstract = "A silicon capacitive force/torque sensor is designed and realized to be used for biomechanical applications and robotics. The sensor is able to measure the forces in three directions and two torques using four parallel capacitor plates and four comb-structures. Novel spring and lever structures are designed to separate the different force components and minimize mechanical crosstalk. The fabrication process is based on deep reactive ion etching on both sides of a single silicon-on-insulator wafer and uses only two masks making it a straight-forward and robust process. The sensor has a force range of 2 N in shear and normal direction and a torque range of more than 6 Nmm. It has a high sensitivity of 38 fF/N and 550 fF/N in shear and normal direction respectively.",

keywords = "METIS-304024, IR-89829, EWI-24583, TST-SENSORS",

author = "Dennis Alveringh and Brookhuis, {Robert Anton} and Wiegerink, {Remco J.} and Krijnen, {Gijsbertus J.M.}",

note = "http://mems2014.org/; 27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014, MEMS ; Conference date: 26-01-2014 Through 30-01-2014",

year = "2014",

month = jan,

day = "26",

doi = "10.1109/MEMSYS.2014.6765732",

language = "English",

isbn = "978-1-4799-3509-3",

publisher = "The Printing House, Inc.",

pages = "680--683",

booktitle = "27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014",

}

Alveringh, D, Brookhuis, RA, Wiegerink, RJ & Krijnen, GJM 2014, A Large Range Multi-Axis Capacitive Force/Torque Sensor Realized in a Single SOI Wafer. in 27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014. The Printing House, Inc., San Francisco, pp. 680-683, 27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014, San Francisco, California, United States, 26/01/14. https://doi.org/10.1109/MEMSYS.2014.6765732

A Large Range Multi-Axis Capacitive Force/Torque Sensor Realized in a Single SOI Wafer. / Alveringh, Dennis; Brookhuis, Robert Anton; Wiegerink, Remco J. et al.
27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014. San Francisco: The Printing House, Inc., 2014. p. 680-683.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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T1 - A Large Range Multi-Axis Capacitive Force/Torque Sensor Realized in a Single SOI Wafer

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AU - Brookhuis, Robert Anton

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AU - Krijnen, Gijsbertus J.M.

N1 - Conference code: 27

PY - 2014/1/26

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N2 - A silicon capacitive force/torque sensor is designed and realized to be used for biomechanical applications and robotics. The sensor is able to measure the forces in three directions and two torques using four parallel capacitor plates and four comb-structures. Novel spring and lever structures are designed to separate the different force components and minimize mechanical crosstalk. The fabrication process is based on deep reactive ion etching on both sides of a single silicon-on-insulator wafer and uses only two masks making it a straight-forward and robust process. The sensor has a force range of 2 N in shear and normal direction and a torque range of more than 6 Nmm. It has a high sensitivity of 38 fF/N and 550 fF/N in shear and normal direction respectively.

AB - A silicon capacitive force/torque sensor is designed and realized to be used for biomechanical applications and robotics. The sensor is able to measure the forces in three directions and two torques using four parallel capacitor plates and four comb-structures. Novel spring and lever structures are designed to separate the different force components and minimize mechanical crosstalk. The fabrication process is based on deep reactive ion etching on both sides of a single silicon-on-insulator wafer and uses only two masks making it a straight-forward and robust process. The sensor has a force range of 2 N in shear and normal direction and a torque range of more than 6 Nmm. It has a high sensitivity of 38 fF/N and 550 fF/N in shear and normal direction respectively.

KW - METIS-304024

KW - IR-89829

KW - EWI-24583

KW - TST-SENSORS

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DO - 10.1109/MEMSYS.2014.6765732

M3 - Conference contribution

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BT - 27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014

PB - The Printing House, Inc.

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T2 - 27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014

Y2 - 26 January 2014 through 30 January 2014

ER -

A Large Range Multi-Axis Capacitive Force/Torque Sensor Realized in a Single SOI Wafer

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Keywords

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