Abstract
In this paper, we present a verification method to compare the hardware and etch performance of different Oxford Instruments dry etching systems to facilitate etch recipe transfer. The flow-pressure window and the chemical and physical flux within the same flow-pressure window were determined for each system. The chemical and physical fluxes were matched between the investigated systems to yield similar etch results. The method was tested using a continuous SF6/O2 silicon etching recipe.
| Original language | English |
|---|---|
| Title of host publication | 2024 16th International Symposium on Electronics and Telecommunications, ISETC 2024 - Conference Proceedings |
| Publisher | IEEE |
| ISBN (Electronic) | 9798350390865 |
| DOIs | |
| Publication status | Published - 2024 |
| Event | 16th International Symposium on Electronics and Telecommunications, ISETC 2024 - Timisoara, Romania Duration: 7 Nov 2024 → 8 Nov 2024 Conference number: 16 |
Conference
| Conference | 16th International Symposium on Electronics and Telecommunications, ISETC 2024 |
|---|---|
| Abbreviated title | ISETC 2024 |
| Country/Territory | Romania |
| City | Timisoara |
| Period | 7/11/24 → 8/11/24 |
Keywords
- 2025 OA procedure
- Si etching
- ICP reactive ion etching
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