Abstract
A novel SOI vertical DMOS transistor on glass for RF power applications is proposed. The device has the same advantages as conventional LDMOS transistors over bipolar transistors with respect to the linearity and efficiency for the high-power, high-frequency applications and adds the advantages of silicon-on-anything technology for the integration with high quality passive components. The gate oxide degradation due to hot carrier generation is inherently eliminated. The metalization on the wafer back includes copper electroplating. A thick copper layer on the wafer back serves as an excellent heat spreader and heat sink. Moreover, it can be used to avoid debiasing due to voltage drops over the metalization. The device performance has been investigated using DC and AC MEDICI simulations and the "Smoothie" database model for FET devices. A device with a breakdown of more than 80V, an fTmaxof 8 GHz, a maximum current of more than 10-4A/μm at VDS=26 V and an RON of 4m Ωcm2 is demonstrated.
Original language | English |
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Title of host publication | 2002 23rd International Conference on Microelectronics, MIEL 2002 - Proceedings |
Publisher | IEEE |
Pages | 159-162 |
Number of pages | 4 |
Volume | 1 |
ISBN (Print) | 9780780372351 |
DOIs | |
Publication status | Published - 1 Jan 2002 |
Externally published | Yes |
Event | 23rd International Conference on Microelectronics, MIEL 2002 - Nis, Serbia Duration: 12 May 2002 → 15 May 2002 Conference number: 23 |
Conference
Conference | 23rd International Conference on Microelectronics, MIEL 2002 |
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Abbreviated title | MIEL 2002 |
Country/Territory | Serbia |
City | Nis |
Period | 12/05/02 → 15/05/02 |