A reliability model for interlayer dielectric cracking during fast thermal cycling

Van Hieu Nguyen, Cora Salm, B.H. Krabbenborg, B.H. Krabbenborg, J. Bisschop, A.J. Mouthaan, F.G. Kuper

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

4 Citations (Scopus)
41 Downloads (Pure)

Abstract

Interlayer dielectric (ILD) cracking can result in short circuits of multilevel interconnects. This paper presents a reliability model for ILD cracking induced by fast thermal cycling (FTC) stress. FTC tests have been performed under different temperature ranges (∆T) and minimum temperatures (Tmin). The Weibull distributions of time to failure are relatively well behaved with a similar slope. The number of cycles to failure increases with increasing Tmin, even though ∆T increases. The Coffin-Manson law is used to model the failure rate only for test results having the same Tmin. The obtained exponent value is in the range of brittle material cracking mechanism, which is confirmed by failure analysis and modeling of the failure mechanism. An extended Coffin-Manson law is developed to model failure rates during FTC stress.
Original languageUndefined
Title of host publicationAdvanced Metallization Conference (AMC 2003)
EditorsGary W. Ray, Tom Smy, Tomohiro Ohta, Manabu Tsujimura
Place of PublicationWarrendale, PA
PublisherMaterials Research Society
Pages295-299
Number of pages5
ISBN (Print)1558997571
Publication statusPublished - 21 Oct 2003

Publication series

Name
PublisherMaterials Research Society

Keywords

  • IR-67736
  • METIS-220203
  • EWI-15555

Cite this

Nguyen, V. H., Salm, C., Krabbenborg, B. H., Krabbenborg, B. H., Bisschop, J., Mouthaan, A. J., & Kuper, F. G. (2003). A reliability model for interlayer dielectric cracking during fast thermal cycling. In G. W. Ray, T. Smy, T. Ohta, & M. Tsujimura (Eds.), Advanced Metallization Conference (AMC 2003) (pp. 295-299). Warrendale, PA: Materials Research Society.
Nguyen, Van Hieu ; Salm, Cora ; Krabbenborg, B.H. ; Krabbenborg, B.H. ; Bisschop, J. ; Mouthaan, A.J. ; Kuper, F.G. / A reliability model for interlayer dielectric cracking during fast thermal cycling. Advanced Metallization Conference (AMC 2003). editor / Gary W. Ray ; Tom Smy ; Tomohiro Ohta ; Manabu Tsujimura. Warrendale, PA : Materials Research Society, 2003. pp. 295-299
@inproceedings{978a25227df04866af04b693b3172ea0,
title = "A reliability model for interlayer dielectric cracking during fast thermal cycling",
abstract = "Interlayer dielectric (ILD) cracking can result in short circuits of multilevel interconnects. This paper presents a reliability model for ILD cracking induced by fast thermal cycling (FTC) stress. FTC tests have been performed under different temperature ranges (∆T) and minimum temperatures (Tmin). The Weibull distributions of time to failure are relatively well behaved with a similar slope. The number of cycles to failure increases with increasing Tmin, even though ∆T increases. The Coffin-Manson law is used to model the failure rate only for test results having the same Tmin. The obtained exponent value is in the range of brittle material cracking mechanism, which is confirmed by failure analysis and modeling of the failure mechanism. An extended Coffin-Manson law is developed to model failure rates during FTC stress.",
keywords = "IR-67736, METIS-220203, EWI-15555",
author = "Nguyen, {Van Hieu} and Cora Salm and B.H. Krabbenborg and B.H. Krabbenborg and J. Bisschop and A.J. Mouthaan and F.G. Kuper",
year = "2003",
month = "10",
day = "21",
language = "Undefined",
isbn = "1558997571",
publisher = "Materials Research Society",
pages = "295--299",
editor = "Ray, {Gary W.} and Tom Smy and Tomohiro Ohta and Manabu Tsujimura",
booktitle = "Advanced Metallization Conference (AMC 2003)",
address = "United States",

}

Nguyen, VH, Salm, C, Krabbenborg, BH, Krabbenborg, BH, Bisschop, J, Mouthaan, AJ & Kuper, FG 2003, A reliability model for interlayer dielectric cracking during fast thermal cycling. in GW Ray, T Smy, T Ohta & M Tsujimura (eds), Advanced Metallization Conference (AMC 2003). Materials Research Society, Warrendale, PA, pp. 295-299.

A reliability model for interlayer dielectric cracking during fast thermal cycling. / Nguyen, Van Hieu; Salm, Cora; Krabbenborg, B.H.; Krabbenborg, B.H.; Bisschop, J.; Mouthaan, A.J.; Kuper, F.G.

Advanced Metallization Conference (AMC 2003). ed. / Gary W. Ray; Tom Smy; Tomohiro Ohta; Manabu Tsujimura. Warrendale, PA : Materials Research Society, 2003. p. 295-299.

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

TY - GEN

T1 - A reliability model for interlayer dielectric cracking during fast thermal cycling

AU - Nguyen, Van Hieu

AU - Salm, Cora

AU - Krabbenborg, B.H.

AU - Krabbenborg, B.H.

AU - Bisschop, J.

AU - Mouthaan, A.J.

AU - Kuper, F.G.

PY - 2003/10/21

Y1 - 2003/10/21

N2 - Interlayer dielectric (ILD) cracking can result in short circuits of multilevel interconnects. This paper presents a reliability model for ILD cracking induced by fast thermal cycling (FTC) stress. FTC tests have been performed under different temperature ranges (∆T) and minimum temperatures (Tmin). The Weibull distributions of time to failure are relatively well behaved with a similar slope. The number of cycles to failure increases with increasing Tmin, even though ∆T increases. The Coffin-Manson law is used to model the failure rate only for test results having the same Tmin. The obtained exponent value is in the range of brittle material cracking mechanism, which is confirmed by failure analysis and modeling of the failure mechanism. An extended Coffin-Manson law is developed to model failure rates during FTC stress.

AB - Interlayer dielectric (ILD) cracking can result in short circuits of multilevel interconnects. This paper presents a reliability model for ILD cracking induced by fast thermal cycling (FTC) stress. FTC tests have been performed under different temperature ranges (∆T) and minimum temperatures (Tmin). The Weibull distributions of time to failure are relatively well behaved with a similar slope. The number of cycles to failure increases with increasing Tmin, even though ∆T increases. The Coffin-Manson law is used to model the failure rate only for test results having the same Tmin. The obtained exponent value is in the range of brittle material cracking mechanism, which is confirmed by failure analysis and modeling of the failure mechanism. An extended Coffin-Manson law is developed to model failure rates during FTC stress.

KW - IR-67736

KW - METIS-220203

KW - EWI-15555

M3 - Conference contribution

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SP - 295

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BT - Advanced Metallization Conference (AMC 2003)

A2 - Ray, Gary W.

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A2 - Ohta, Tomohiro

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Nguyen VH, Salm C, Krabbenborg BH, Krabbenborg BH, Bisschop J, Mouthaan AJ et al. A reliability model for interlayer dielectric cracking during fast thermal cycling. In Ray GW, Smy T, Ohta T, Tsujimura M, editors, Advanced Metallization Conference (AMC 2003). Warrendale, PA: Materials Research Society. 2003. p. 295-299