A Reliability Model for interlayer dielectrics cracking during very fast thermal cycling

Van Hieu Nguyen, Cora Salm, B.H. Krabbenborg, J. Bisschop, A.J. Mouthaan, F.G. Kuper

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

Original language	Undefined
Title of host publication	Proceedings of Advanced Metallization Conference AMC 2003
Pages	-
Publication status	Published - 21 Oct 2003

Keywords

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title = "A Reliability Model for interlayer dielectrics cracking during very fast thermal cycling",

keywords = "METIS-213258",

author = "Nguyen, {Van Hieu} and Cora Salm and B.H. Krabbenborg and J. Bisschop and A.J. Mouthaan and F.G. Kuper",

year = "2003",

month = oct,

day = "21",

language = "Undefined",

pages = "--",

booktitle = "Proceedings of Advanced Metallization Conference AMC 2003",

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TY - GEN

T1 - A Reliability Model for interlayer dielectrics cracking during very fast thermal cycling

AU - Nguyen, Van Hieu

AU - Salm, Cora

AU - Krabbenborg, B.H.

AU - Bisschop, J.

AU - Mouthaan, A.J.

AU - Kuper, F.G.

PY - 2003/10/21

Y1 - 2003/10/21

KW - METIS-213258

M3 - Conference contribution

SP - -

BT - Proceedings of Advanced Metallization Conference AMC 2003

ER -