A Reliability Model for interlayer dielectrics cracking during very fast thermal cycling

Van Hieu Nguyen, Cora Salm, B.H. Krabbenborg, J. Bisschop, A.J. Mouthaan, F.G. Kuper

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    Original languageUndefined
    Title of host publicationProceedings of Advanced Metallization Conference AMC 2003
    Pages-
    Publication statusPublished - 21 Oct 2003

    Keywords

    • METIS-213258

    Cite this

    Nguyen, V. H., Salm, C., Krabbenborg, B. H., Bisschop, J., Mouthaan, A. J., & Kuper, F. G. (2003). A Reliability Model for interlayer dielectrics cracking during very fast thermal cycling. In Proceedings of Advanced Metallization Conference AMC 2003 (pp. -)