A Reliability Model for interlayer dielectrics cracking during very fast thermal cycling

Van Hieu Nguyen, Cora Salm, B.H. Krabbenborg, J. Bisschop, A.J. Mouthaan, F.G. Kuper

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    Original languageUndefined
    Title of host publicationProceedings of Advanced Metallization Conference AMC 2003
    Publication statusPublished - 21 Oct 2003


    • METIS-213258

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