TY - JOUR
T1 - A review of silicon microphones
AU - Scheeper, P.R.
AU - van der Donk, A.G.H.
AU - Olthuis, W.
AU - Bergveld, P.
PY - 1994
Y1 - 1994
N2 - Silicon micromachining has successfully been applied to fabricate piezoelectric, piezoresistive and capactive microphones. The use of silicon has allowed the fabrication of microphones with integrated electronic circuitry and the development of the new FET microphone. The introduction of lithographic techniques has resulted in microphones with very small (1 mm2) diaphragms and with specially shaped backplates. The application of corrugated diaphragms seems a promising future development for silicon microphones. It is concluded from a noise consideration that the FET microphone shows a high noise level, which is mainly due to the small sensor capacitance. From this noise consideration, it can be shown that integration of a capacitive microphone and a preamplifier will result in a further reduction of the noise.
AB - Silicon micromachining has successfully been applied to fabricate piezoelectric, piezoresistive and capactive microphones. The use of silicon has allowed the fabrication of microphones with integrated electronic circuitry and the development of the new FET microphone. The introduction of lithographic techniques has resulted in microphones with very small (1 mm2) diaphragms and with specially shaped backplates. The application of corrugated diaphragms seems a promising future development for silicon microphones. It is concluded from a noise consideration that the FET microphone shows a high noise level, which is mainly due to the small sensor capacitance. From this noise consideration, it can be shown that integration of a capacitive microphone and a preamplifier will result in a further reduction of the noise.
U2 - 10.1016/0924-4247(94)00790-X
DO - 10.1016/0924-4247(94)00790-X
M3 - Article
SN - 0924-4247
VL - 44
SP - 1
EP - 11
JO - Sensors and Actuators A: Physical
JF - Sensors and Actuators A: Physical
IS - 1
ER -
