A roadmap to a technological platform for integrating nanophotonic structures with micromechanical systems in silicon-on-insulator

Jacek K. Zientkiewicz; Zbigniew T. Lach; Piotr Grabiec; A. Driessen; Bozena Jaskorzynska; Lech Wosinski

doi:10.1117/12.622442

A roadmap to a technological platform for integrating nanophotonic structures with micromechanical systems in silicon-on-insulator

Jacek K. Zientkiewicz, Zbigniew T. Lach, Piotr Grabiec, A. Driessen, Bozena Jaskorzynska, Lech Wosinski

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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Abstract

On the foundation of joint experience acquired by several research centres there was defined the roadmap to the desired single technological platform for fabrication of a specific class of photonic integrated circuits, which are controlled by mechanical means. In the paper the challenges of fabrication of such photonic circuits are discussed. The main arguments in favour of the Silicon-on-Insulator materials system as the basis for the platform are presented. Options for the mechanics-to-optics arrangement, materials and processes are described and illustrated with the current achievements from the authors' labs. In the roadmap the preference is given to the vertical arrangement in which, the mechanical part is stacked above the waveguiding layer. A flexible trimming routine is designed to complement the process flow if the technologies developed cannot provide the required reproducibility.

Original language	English
Title of host publication	Integrated Optics: Theory and Applications
Editors	Tadeusz Pustelny, Paul Lambeck, Christophe Gorecki
Place of Publication	Washington, USA
Publisher	SPIE
Pages	59560H
Number of pages	11
ISBN (Print)	0819459631
DOIs	https://doi.org/10.1117/12.622442
Publication status	Published - Aug 2005
Event	SPIE International Congress on Optics and Optoelectronics 2005 - Warsaw University of Technology, Warsaw, Poland Duration: 28 Aug 2005 → 2 Sept 2005

Publication series

Name	Proceedings of SPIE
Publisher	SPIE The International Society for Optical Engineering
Volume	5956
ISSN (Print)	0277-786X

Conference

Conference	SPIE International Congress on Optics and Optoelectronics 2005
Country/Territory	Poland
City	Warsaw
Period	28/08/05 → 2/09/05

Keywords

Waveguide optical resonators
Silicon on insulator technology
Add-drop filters
IOMS-PIT: PHOTONICS INTEGRATION TECHNOLOGY
Mechanically assisted photonic integrated circuits
Micro/nano-mechanical systems
n/a OA procedure

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10.1117/12.622442

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Zientkiewicz, J. K., Lach, Z. T., Grabiec, P., Driessen, A., Jaskorzynska, B., & Wosinski, L. (2005). A roadmap to a technological platform for integrating nanophotonic structures with micromechanical systems in silicon-on-insulator. In T. Pustelny, P. Lambeck, & C. Gorecki (Eds.), Integrated Optics: Theory and Applications (pp. 59560H). (Proceedings of SPIE; Vol. 5956). SPIE. https://doi.org/10.1117/12.622442

Zientkiewicz, Jacek K. ; Lach, Zbigniew T. ; Grabiec, Piotr et al. / A roadmap to a technological platform for integrating nanophotonic structures with micromechanical systems in silicon-on-insulator. Integrated Optics: Theory and Applications. editor / Tadeusz Pustelny ; Paul Lambeck ; Christophe Gorecki. Washington, USA : SPIE, 2005. pp. 59560H (Proceedings of SPIE).

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title = "A roadmap to a technological platform for integrating nanophotonic structures with micromechanical systems in silicon-on-insulator",

abstract = "On the foundation of joint experience acquired by several research centres there was defined the roadmap to the desired single technological platform for fabrication of a specific class of photonic integrated circuits, which are controlled by mechanical means. In the paper the challenges of fabrication of such photonic circuits are discussed. The main arguments in favour of the Silicon-on-Insulator materials system as the basis for the platform are presented. Options for the mechanics-to-optics arrangement, materials and processes are described and illustrated with the current achievements from the authors' labs. In the roadmap the preference is given to the vertical arrangement in which, the mechanical part is stacked above the waveguiding layer. A flexible trimming routine is designed to complement the process flow if the technologies developed cannot provide the required reproducibility.",

keywords = "Waveguide optical resonators, Silicon on insulator technology, Add-drop filters, IOMS-PIT: PHOTONICS INTEGRATION TECHNOLOGY, Mechanically assisted photonic integrated circuits, Micro/nano-mechanical systems, n/a OA procedure",

author = "Zientkiewicz, {Jacek K.} and Lach, {Zbigniew T.} and Piotr Grabiec and A. Driessen and Bozena Jaskorzynska and Lech Wosinski",

year = "2005",

month = aug,

doi = "10.1117/12.622442",

language = "English",

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series = "Proceedings of SPIE",

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editor = "Tadeusz Pustelny and Paul Lambeck and Christophe Gorecki",

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Zientkiewicz, JK, Lach, ZT, Grabiec, P, Driessen, A, Jaskorzynska, B & Wosinski, L 2005, A roadmap to a technological platform for integrating nanophotonic structures with micromechanical systems in silicon-on-insulator. in T Pustelny, P Lambeck & C Gorecki (eds), Integrated Optics: Theory and Applications. Proceedings of SPIE, vol. 5956, SPIE, Washington, USA, pp. 59560H, SPIE International Congress on Optics and Optoelectronics 2005, Warsaw, Poland, 28/08/05. https://doi.org/10.1117/12.622442

A roadmap to a technological platform for integrating nanophotonic structures with micromechanical systems in silicon-on-insulator. / Zientkiewicz, Jacek K.; Lach, Zbigniew T.; Grabiec, Piotr et al.
Integrated Optics: Theory and Applications. ed. / Tadeusz Pustelny; Paul Lambeck; Christophe Gorecki. Washington, USA: SPIE, 2005. p. 59560H (Proceedings of SPIE; Vol. 5956).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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AU - Zientkiewicz, Jacek K.

AU - Lach, Zbigniew T.

AU - Grabiec, Piotr

AU - Driessen, A.

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N2 - On the foundation of joint experience acquired by several research centres there was defined the roadmap to the desired single technological platform for fabrication of a specific class of photonic integrated circuits, which are controlled by mechanical means. In the paper the challenges of fabrication of such photonic circuits are discussed. The main arguments in favour of the Silicon-on-Insulator materials system as the basis for the platform are presented. Options for the mechanics-to-optics arrangement, materials and processes are described and illustrated with the current achievements from the authors' labs. In the roadmap the preference is given to the vertical arrangement in which, the mechanical part is stacked above the waveguiding layer. A flexible trimming routine is designed to complement the process flow if the technologies developed cannot provide the required reproducibility.

AB - On the foundation of joint experience acquired by several research centres there was defined the roadmap to the desired single technological platform for fabrication of a specific class of photonic integrated circuits, which are controlled by mechanical means. In the paper the challenges of fabrication of such photonic circuits are discussed. The main arguments in favour of the Silicon-on-Insulator materials system as the basis for the platform are presented. Options for the mechanics-to-optics arrangement, materials and processes are described and illustrated with the current achievements from the authors' labs. In the roadmap the preference is given to the vertical arrangement in which, the mechanical part is stacked above the waveguiding layer. A flexible trimming routine is designed to complement the process flow if the technologies developed cannot provide the required reproducibility.

KW - Waveguide optical resonators

KW - Silicon on insulator technology

KW - Add-drop filters

KW - IOMS-PIT: PHOTONICS INTEGRATION TECHNOLOGY

KW - Mechanically assisted photonic integrated circuits

KW - Micro/nano-mechanical systems

KW - n/a OA procedure

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DO - 10.1117/12.622442

M3 - Conference contribution

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T3 - Proceedings of SPIE

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BT - Integrated Optics: Theory and Applications

A2 - Pustelny, Tadeusz

A2 - Lambeck, Paul

A2 - Gorecki, Christophe

PB - SPIE

CY - Washington, USA

T2 - SPIE International Congress on Optics and Optoelectronics 2005

Y2 - 28 August 2005 through 2 September 2005

ER -

Zientkiewicz JK, Lach ZT, Grabiec P, Driessen A, Jaskorzynska B, Wosinski L. A roadmap to a technological platform for integrating nanophotonic structures with micromechanical systems in silicon-on-insulator. In Pustelny T, Lambeck P, Gorecki C, editors, Integrated Optics: Theory and Applications. Washington, USA: SPIE. 2005. p. 59560H. (Proceedings of SPIE). doi: 10.1117/12.622442

A roadmap to a technological platform for integrating nanophotonic structures with micromechanical systems in silicon-on-insulator

Abstract

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Keywords

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