TY - GEN
T1 - A Self-Aligned Wafer-Scale Gate-All-Around Aperture Definition Method for Silicon Nanostructures
AU - Jonker, Dirk
AU - Berenschot, Erwin J.W.
AU - Tiggelaar, Roald M.
AU - Tas, Niels R.
AU - Van Houselt, Arie
AU - Gardeniers, Han J.G.E.
N1 - Funding Information:
The authors also would like to thank the Netherlands Center for Multiscale Catalytic Energy Conversion (MCEC), an NWO Gravitation program, funded by the Ministry of Education, Culture and Science of the government of the Netherlands.
Publisher Copyright:
© 2022 IEEE.
PY - 2022/2/11
Y1 - 2022/2/11
N2 - A novel fabrication technique is developed to deliver self-aligned gate structures on vertically aligned periodic silicon nanocones with gate aperture radii of 65±3 nm and a surface density of 1.6 billion structures cm-2 across the 100 mm diameter substrate scale. The silicon nanocones were obtained by a combination of ion beam etching and thermal oxidation whereas the gate structures were obtained by a combination of ion beam etching planarization and selective wet chemical etching.
AB - A novel fabrication technique is developed to deliver self-aligned gate structures on vertically aligned periodic silicon nanocones with gate aperture radii of 65±3 nm and a surface density of 1.6 billion structures cm-2 across the 100 mm diameter substrate scale. The silicon nanocones were obtained by a combination of ion beam etching and thermal oxidation whereas the gate structures were obtained by a combination of ion beam etching planarization and selective wet chemical etching.
KW - cold field emitters
KW - low energy ion beam etching
KW - Planarization
KW - self-aligned fabrication
KW - 22/4 OA procedure
UR - http://www.scopus.com/inward/record.url?scp=85126394154&partnerID=8YFLogxK
U2 - 10.1109/MEMS51670.2022.9699565
DO - 10.1109/MEMS51670.2022.9699565
M3 - Conference contribution
AN - SCOPUS:85126394154
T3 - IEEE Symposium on Mass Storage Systems and Technologies
SP - 561
EP - 564
BT - 35th IEEE International Conference on Micro Electro Mechanical Systems Conference, MEMS 2022
PB - IEEE
T2 - 35th IEEE International Conference on Micro Electro Mechanical Systems Conference, MEMS 2022
Y2 - 9 January 2022 through 13 January 2022
ER -