Position sensing in MEMS is often based on the principle of varying capacitance . Alternative position sensing principles include using integrated optical waveguides  or varying thermal conductance . Lantz et al demonstrated a thermal displacement sensor achieving nanometre resolution on a 100mm range. However a multi-mask production process and manual assembly were needed to fabricate this displacement sensor. In this work we present a 1-DOF thermal displacement sensor integrated with an actuated stage, and its experimental characterization. The system was fabricated in the device layer of a silicon-on-insulator (SOI) wafer using a single-mask process.
|Title of host publication||Proceedings of the Tenth International Conference of the European Society for Precision Engineering & Nanotechnology|
|Place of Publication||Delft|
|Publisher||Delft University of Technology|
|Number of pages||4|
|Publication status||Published - Jun 2010|
|Event||10th EUSPEN International Conference 2010 - Delft, Netherlands|
Duration: 31 May 2010 → 4 Jun 2010
Conference number: 10
|Conference||10th EUSPEN International Conference 2010|
|Period||31/05/10 → 4/06/10|
|Other||NOT the same as 10th Anniversary International Conference (see dates and place)|
- TST-SMI: Formerly in EWI-SMI
- TST-uSPAM: micro Scanning Probe Array Memory
Hogervorst, R. P., Krijnen, B., Krijnen, B., Brouwer, D. M., Engelen, J. B. C., & Staufer, U. (2010). A single-mask thermal displacement sensor in MEMS. In Proceedings of the Tenth International Conference of the European Society for Precision Engineering & Nanotechnology (pp. 462-465). Delft: Delft University of Technology.