A single-mask thermal displacement sensor in MEMS

R.P. Hogervorst, B. Krijnen, B. Krijnen, Dannis Michel Brouwer, Johannes Bernardus Charles Engelen, U. Staufer

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademic

3 Citations (Scopus)
64 Downloads (Pure)

Abstract

Position sensing in MEMS is often based on the principle of varying capacitance [1]. Alternative position sensing principles include using integrated optical waveguides [2] or varying thermal conductance [3]. Lantz et al demonstrated a thermal displacement sensor achieving nanometre resolution on a 100mm range. However a multi-mask production process and manual assembly were needed to fabricate this displacement sensor. In this work we present a 1-DOF thermal displacement sensor integrated with an actuated stage, and its experimental characterization. The system was fabricated in the device layer of a silicon-on-insulator (SOI) wafer using a single-mask process.
Original languageEnglish
Title of host publicationProceedings of the Tenth International Conference of the European Society for Precision Engineering & Nanotechnology
Place of PublicationDelft
PublisherDelft University of Technology
Pages462-465
Number of pages4
ISBN (Print)978-0-9553082-8-4
Publication statusPublished - Jun 2010
Event10th EUSPEN International Conference 2010 - Delft, Netherlands
Duration: 31 May 20104 Jun 2010
Conference number: 10

Publication series

Name
PublisherDelft University

Conference

Conference10th EUSPEN International Conference 2010
Abbreviated titleEUSPEN
CountryNetherlands
CityDelft
Period31/05/104/06/10
OtherNOT the same as 10th Anniversary International Conference (see dates and place)

Keywords

  • METIS-267224
  • IR-75551
  • EWI-19241
  • TST-SMI: Formerly in EWI-SMI
  • TST-uSPAM: micro Scanning Probe Array Memory

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  • Cite this

    Hogervorst, R. P., Krijnen, B., Krijnen, B., Brouwer, D. M., Engelen, J. B. C., & Staufer, U. (2010). A single-mask thermal displacement sensor in MEMS. In Proceedings of the Tenth International Conference of the European Society for Precision Engineering & Nanotechnology (pp. 462-465). Delft: Delft University of Technology.