A software framework to calculate local temperatures in CMOS processors

A. Rohani, Hassan Ebrahimi, Hans G. Kerkhoff

    Research output: Contribution to conferencePaper

    4 Citations (Scopus)

    Abstract

    A conventional technique to rise temperature in a processor involves the usage of thermal ovens or infrared techniques to heat up and then measure the temperature of the processor. However, local temperatures of each module cannot be controlled by these techniques. This paper presents a software mechanism to heat-up a processor while the temperature of each modules of the processor can precisely be calculated. In order to develop our mechanism, first a mathematical model to correlate dynamic power and local temperature has been developed; next a framework that calculates local temperature for any given workload has been presented. In order to show the details of our model, the proposed framework has been applied to a thirty-two bit full-adder. The applicability of our framework has been demonstrated by using a complex DSP (Digital Signal Processor) as the case study. This paper will show that, despite common belief, there is no linear correlation between dynamic power and local temperatures of a chip.
    Original languageEnglish
    Pages183-188
    Number of pages6
    DOIs
    Publication statusPublished - 2016
    Event26th International Workshop on Power and Timing Modeling, Optimization and Simulation - Bremen, Germany
    Duration: 21 Sep 201623 Sep 2016
    Conference number: 26
    http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=7813533

    Conference

    Conference26th International Workshop on Power and Timing Modeling, Optimization and Simulation
    Abbreviated titlePATMOS 2016
    CountryGermany
    CityBremen
    Period21/09/1623/09/16
    Internet address

    Keywords

    • CMOS logic circuits;adders;circuit CAD;digital signal processing chips;temperature measurement;thermal management (packaging);CMOS processors;DSP;digital signal processor;dynamic power-local temperature correlation;infrared techniques;local temperature calculation;mathematical model;software mechanism;thermal ovens;thirty-two bit full-adder;Heat transfer;Mathematical model;Numerical models;Resistance heating;Semiconductor device modeling;Thermal resistance;CAD;Processors;Thermal-aware design

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