A software framework to calculate local temperatures in CMOS processors

A. Rohani, Hassan Ebrahimi, Hans G. Kerkhoff

Research output: Contribution to conferencePaperAcademicpeer-review

4 Citations (Scopus)

Abstract

A conventional technique to rise temperature in a processor involves the usage of thermal ovens or infrared techniques to heat up and then measure the temperature of the processor. However, local temperatures of each module cannot be controlled by these techniques. This paper presents a software mechanism to heat-up a processor while the temperature of each modules of the processor can precisely be calculated. In order to develop our mechanism, first a mathematical model to correlate dynamic power and local temperature has been developed; next a framework that calculates local temperature for any given workload has been presented. In order to show the details of our model, the proposed framework has been applied to a thirty-two bit full-adder. The applicability of our framework has been demonstrated by using a complex DSP (Digital Signal Processor) as the case study. This paper will show that, despite common belief, there is no linear correlation between dynamic power and local temperatures of a chip.
Original languageEnglish
Pages183-188
Number of pages6
DOIs
Publication statusPublished - 2016
Event26th International Workshop on Power and Timing Modeling, Optimization and Simulation - Bremen, Germany
Duration: 21 Sep 201623 Sep 2016
Conference number: 26
http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=7813533

Conference

Conference26th International Workshop on Power and Timing Modeling, Optimization and Simulation
Abbreviated titlePATMOS 2016
CountryGermany
CityBremen
Period21/09/1623/09/16
Internet address

Fingerprint

Temperature
Adders
Digital signal processors
Ovens
Mathematical models
Infrared radiation
Hot Temperature

Keywords

  • CMOS logic circuits;adders;circuit CAD;digital signal processing chips;temperature measurement;thermal management (packaging);CMOS processors;DSP;digital signal processor;dynamic power-local temperature correlation;infrared techniques;local temperature calculation;mathematical model;software mechanism;thermal ovens;thirty-two bit full-adder;Heat transfer;Mathematical model;Numerical models;Resistance heating;Semiconductor device modeling;Thermal resistance;CAD;Processors;Thermal-aware design

Cite this

Rohani, A., Ebrahimi, H., & Kerkhoff, H. G. (2016). A software framework to calculate local temperatures in CMOS processors. 183-188. Paper presented at 26th International Workshop on Power and Timing Modeling, Optimization and Simulation, Bremen, Germany. https://doi.org/10.1109/PATMOS.2016.7833685
Rohani, A. ; Ebrahimi, Hassan ; Kerkhoff, Hans G. / A software framework to calculate local temperatures in CMOS processors. Paper presented at 26th International Workshop on Power and Timing Modeling, Optimization and Simulation, Bremen, Germany.6 p.
@conference{e310f51bbab347c5ac55fe353e9dcae3,
title = "A software framework to calculate local temperatures in CMOS processors",
abstract = "A conventional technique to rise temperature in a processor involves the usage of thermal ovens or infrared techniques to heat up and then measure the temperature of the processor. However, local temperatures of each module cannot be controlled by these techniques. This paper presents a software mechanism to heat-up a processor while the temperature of each modules of the processor can precisely be calculated. In order to develop our mechanism, first a mathematical model to correlate dynamic power and local temperature has been developed; next a framework that calculates local temperature for any given workload has been presented. In order to show the details of our model, the proposed framework has been applied to a thirty-two bit full-adder. The applicability of our framework has been demonstrated by using a complex DSP (Digital Signal Processor) as the case study. This paper will show that, despite common belief, there is no linear correlation between dynamic power and local temperatures of a chip.",
keywords = "CMOS logic circuits;adders;circuit CAD;digital signal processing chips;temperature measurement;thermal management (packaging);CMOS processors;DSP;digital signal processor;dynamic power-local temperature correlation;infrared techniques;local temperature calculation;mathematical model;software mechanism;thermal ovens;thirty-two bit full-adder;Heat transfer;Mathematical model;Numerical models;Resistance heating;Semiconductor device modeling;Thermal resistance;CAD;Processors;Thermal-aware design",
author = "A. Rohani and Hassan Ebrahimi and Kerkhoff, {Hans G.}",
year = "2016",
doi = "10.1109/PATMOS.2016.7833685",
language = "English",
pages = "183--188",
note = "26th International Workshop on Power and Timing Modeling, Optimization and Simulation, PATMOS 2016 ; Conference date: 21-09-2016 Through 23-09-2016",
url = "http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=7813533",

}

Rohani, A, Ebrahimi, H & Kerkhoff, HG 2016, 'A software framework to calculate local temperatures in CMOS processors' Paper presented at 26th International Workshop on Power and Timing Modeling, Optimization and Simulation, Bremen, Germany, 21/09/16 - 23/09/16, pp. 183-188. https://doi.org/10.1109/PATMOS.2016.7833685

A software framework to calculate local temperatures in CMOS processors. / Rohani, A.; Ebrahimi, Hassan ; Kerkhoff, Hans G.

2016. 183-188 Paper presented at 26th International Workshop on Power and Timing Modeling, Optimization and Simulation, Bremen, Germany.

Research output: Contribution to conferencePaperAcademicpeer-review

TY - CONF

T1 - A software framework to calculate local temperatures in CMOS processors

AU - Rohani, A.

AU - Ebrahimi, Hassan

AU - Kerkhoff, Hans G.

PY - 2016

Y1 - 2016

N2 - A conventional technique to rise temperature in a processor involves the usage of thermal ovens or infrared techniques to heat up and then measure the temperature of the processor. However, local temperatures of each module cannot be controlled by these techniques. This paper presents a software mechanism to heat-up a processor while the temperature of each modules of the processor can precisely be calculated. In order to develop our mechanism, first a mathematical model to correlate dynamic power and local temperature has been developed; next a framework that calculates local temperature for any given workload has been presented. In order to show the details of our model, the proposed framework has been applied to a thirty-two bit full-adder. The applicability of our framework has been demonstrated by using a complex DSP (Digital Signal Processor) as the case study. This paper will show that, despite common belief, there is no linear correlation between dynamic power and local temperatures of a chip.

AB - A conventional technique to rise temperature in a processor involves the usage of thermal ovens or infrared techniques to heat up and then measure the temperature of the processor. However, local temperatures of each module cannot be controlled by these techniques. This paper presents a software mechanism to heat-up a processor while the temperature of each modules of the processor can precisely be calculated. In order to develop our mechanism, first a mathematical model to correlate dynamic power and local temperature has been developed; next a framework that calculates local temperature for any given workload has been presented. In order to show the details of our model, the proposed framework has been applied to a thirty-two bit full-adder. The applicability of our framework has been demonstrated by using a complex DSP (Digital Signal Processor) as the case study. This paper will show that, despite common belief, there is no linear correlation between dynamic power and local temperatures of a chip.

KW - CMOS logic circuits;adders;circuit CAD;digital signal processing chips;temperature measurement;thermal management (packaging);CMOS processors;DSP;digital signal processor;dynamic power-local temperature correlation;infrared techniques;local temperature ca

U2 - 10.1109/PATMOS.2016.7833685

DO - 10.1109/PATMOS.2016.7833685

M3 - Paper

SP - 183

EP - 188

ER -

Rohani A, Ebrahimi H, Kerkhoff HG. A software framework to calculate local temperatures in CMOS processors. 2016. Paper presented at 26th International Workshop on Power and Timing Modeling, Optimization and Simulation, Bremen, Germany. https://doi.org/10.1109/PATMOS.2016.7833685