A test chip for automatic reliability measurements of interconnect vias

K. Lippe; A. Hasper; G.W. Elfrink; J. Niehof; Hans G. Kerkhoff

doi:10.1109/RELPHY.1992.187653

A test chip for automatic reliability measurements of interconnect vias

K. Lippe, A. Hasper, G.W. Elfrink, J. Niehof, Hans G. Kerkhoff

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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Abstract

A test circuit for electromigration reliability measurements was designed and tested. The device under test (DUT) is a via-hole chain. The test circuit permits simultaneous measurements of a number of DUTs, and a fatal error of one DUT does not influence the measurement results of the other DUTs. Measurements require only a few measurement instruments. Comparing the measurement results of a single DUT io the measurement results of the test circuit shows that the test circuit may be used for reliability measurements.

Original language	English
Title of host publication	30th Annual Proceedings Reliability Physics 1992
Place of Publication	Piscataway, NJ
Publisher	IEEE
Pages	247-250
ISBN (Print)	9780780304734
DOIs	https://doi.org/10.1109/RELPHY.1992.187653
Publication status	Published - 31 Mar 1992
Event	30th Annual IEEE International Reliability Physics Symposium, IRPS 1992 - San Diego, United States Duration: 31 Mar 1992 → 2 Apr 1992 Conference number: 30

Conference

Conference	30th Annual IEEE International Reliability Physics Symposium, IRPS 1992
Abbreviated title	IRPS
Country/Territory	United States
City	San Diego
Period	31/03/92 → 2/04/92

Keywords

METIS-112932
IR-58965

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10.1109/RELPHY.1992.187653

Lippe92testFinal published version, 274 KB

Cite this

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title = "A test chip for automatic reliability measurements of interconnect vias",

abstract = "A test circuit for electromigration reliability measurements was designed and tested. The device under test (DUT) is a via-hole chain. The test circuit permits simultaneous measurements of a number of DUTs, and a fatal error of one DUT does not influence the measurement results of the other DUTs. Measurements require only a few measurement instruments. Comparing the measurement results of a single DUT io the measurement results of the test circuit shows that the test circuit may be used for reliability measurements.",

keywords = "METIS-112932, IR-58965",

author = "K. Lippe and A. Hasper and G.W. Elfrink and J. Niehof and Kerkhoff, {Hans G.}",

year = "1992",

month = mar,

day = "31",

doi = "10.1109/RELPHY.1992.187653",

language = "English",

isbn = "9780780304734",

pages = "247--250",

booktitle = "30th Annual Proceedings Reliability Physics 1992",

publisher = "IEEE",

address = "United States",

note = "30th Annual IEEE International Reliability Physics Symposium, IRPS 1992, IRPS ; Conference date: 31-03-1992 Through 02-04-1992",

}

Lippe, K, Hasper, A, Elfrink, GW, Niehof, J & Kerkhoff, HG 1992, A test chip for automatic reliability measurements of interconnect vias. in 30th Annual Proceedings Reliability Physics 1992. IEEE, Piscataway, NJ, pp. 247-250, 30th Annual IEEE International Reliability Physics Symposium, IRPS 1992, San Diego, California, United States, 31/03/92. https://doi.org/10.1109/RELPHY.1992.187653

TY - GEN

T1 - A test chip for automatic reliability measurements of interconnect vias

AU - Lippe, K.

AU - Hasper, A.

AU - Elfrink, G.W.

AU - Niehof, J.

AU - Kerkhoff, Hans G.

N1 - Conference code: 30

PY - 1992/3/31

Y1 - 1992/3/31

N2 - A test circuit for electromigration reliability measurements was designed and tested. The device under test (DUT) is a via-hole chain. The test circuit permits simultaneous measurements of a number of DUTs, and a fatal error of one DUT does not influence the measurement results of the other DUTs. Measurements require only a few measurement instruments. Comparing the measurement results of a single DUT io the measurement results of the test circuit shows that the test circuit may be used for reliability measurements.

AB - A test circuit for electromigration reliability measurements was designed and tested. The device under test (DUT) is a via-hole chain. The test circuit permits simultaneous measurements of a number of DUTs, and a fatal error of one DUT does not influence the measurement results of the other DUTs. Measurements require only a few measurement instruments. Comparing the measurement results of a single DUT io the measurement results of the test circuit shows that the test circuit may be used for reliability measurements.

KW - METIS-112932

KW - IR-58965

U2 - 10.1109/RELPHY.1992.187653

DO - 10.1109/RELPHY.1992.187653

M3 - Conference contribution

SN - 9780780304734

SP - 247

EP - 250

BT - 30th Annual Proceedings Reliability Physics 1992

PB - IEEE

CY - Piscataway, NJ

T2 - 30th Annual IEEE International Reliability Physics Symposium, IRPS 1992

Y2 - 31 March 1992 through 2 April 1992

ER -

A test chip for automatic reliability measurements of interconnect vias

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