A test chip for automatic reliability measurements of interconnect vias

K. Lippe, A. Hasper, G.W. Elfrink, J. Niehof, Hans G. Kerkhoff

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    Abstract

    A test circuit for electromigration reliability measurements was designed and tested. The device under test (DUT) is a via-hole chain. The test circuit permits simultaneous measurements of a number of DUTs, and a fatal error of one DUT does not influence the measurement results of the other DUTs. Measurements require only a few measurement instruments. Comparing the measurement results of a single DUT io the measurement results of the test circuit shows that the test circuit may be used for reliability measurements.
    Original languageEnglish
    Title of host publication30th Annual Proceedings Reliability Physics 1992
    Place of PublicationPiscataway, NJ
    PublisherIEEE
    Pages247-250
    ISBN (Print)9780780304734
    DOIs
    Publication statusPublished - 31 Mar 1992
    Event30th Annual IEEE International Reliability Physics Symposium, IRPS 1992 - San Diego, United States
    Duration: 31 Mar 19922 Apr 1992
    Conference number: 30

    Conference

    Conference30th Annual IEEE International Reliability Physics Symposium, IRPS 1992
    Abbreviated titleIRPS
    CountryUnited States
    CitySan Diego
    Period31/03/922/04/92

    Keywords

    • METIS-112932
    • IR-58965

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