Adding functionality to microchips by wafer post-processing

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    The traditional microchip processes, stores and communicates electrical information. Here we review an emerging class of microchips that have additional functionality through extra integrated components in the chip. In the final manufacturing stage, layers are added on top of the chip, with a specific property such as sensitivity to ionizing radiation. This paper reviews the technology underlying these monolithic microsystems, including the incorporation of new materials, the unconventional application of photoresist layers, and low-temperature technology for suspended membranes. The manufacturing of exemplary microsystems, such as the active pixel sensor and liquid-crystalon-silicon, is detailed. A new class of fully integrated radiation imaging systems is now technologically within reach.
    Original languageEnglish
    Article number10.1016/j.nima.2007.01.142
    Pages (from-to)142-149
    Number of pages10
    JournalNuclear instruments & methods in physics research. Section A : Accelerators, spectrometers, detectors and associated equipment
    Issue number2/1
    Publication statusPublished - 16 Jun 2007


    • METIS-242081
    • EWI-9538
    • IR-63977
    • SC-ICF: Integrated Circuit Fabrication


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