Additive interconnect fabrication by picosecond laser induced forward transfer

G. Oosterhuis, Bert Huis in 't Veld, G.H.P. Ebberink, D. Arnaldo del Cerro, N.C. van den Eijnden, P. Chall

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    4 Citations (Scopus)
    Original languageEnglish
    Title of host publicationProceedings ot the IEEE International 3D Systems Integration Conference 2010, 3DIC
    Place of PublicationMunich, Germany
    Pages-
    Publication statusPublished - 16 Nov 2010
    EventIEEE International 3D Systems Integration Conference 2010, 3DIC: Proceedings ot the IEEE International 3D Systems Integration Conference 2010, 3DIC - Munich, Germany
    Duration: 16 Nov 201018 Nov 2010

    Conference

    ConferenceIEEE International 3D Systems Integration Conference 2010, 3DIC
    CityMunich, Germany
    Period16/11/1018/11/10

    Keywords

    • METIS-269599

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