Additive interconnect fabrication by picosecond laser induced forward transfer

G. Oosterhuis; Bert Huis in 't Veld; G.H.P. Ebberink; D. Arnaldo del Cerro; N.C. van den Eijnden; P. Chall

Additive interconnect fabrication by picosecond laser induced forward transfer

G. Oosterhuis, Bert Huis in 't Veld, G.H.P. Ebberink, D. Arnaldo del Cerro, N.C. van den Eijnden, P. Chall

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

Original language	English
Title of host publication	Proceedings ot the IEEE International 3D Systems Integration Conference 2010, 3DIC
Place of Publication	Munich, Germany
Pages	-
Publication status	Published - 16 Nov 2010
Event	IEEE International 3D Systems Integration Conference 2010, 3DIC: Proceedings ot the IEEE International 3D Systems Integration Conference 2010, 3DIC - Munich, Germany Duration: 16 Nov 2010 → 18 Nov 2010

Conference

Conference	IEEE International 3D Systems Integration Conference 2010, 3DIC
City	Munich, Germany
Period	16/11/10 → 18/11/10

Keywords

METIS-269599

Cite this

@inproceedings{1087ec22e0ee4ac5ae7032ea4cc836df,

title = "Additive interconnect fabrication by picosecond laser induced forward transfer",

keywords = "METIS-269599",

author = "G. Oosterhuis and {Huis in 't Veld}, Bert and G.H.P. Ebberink and {Arnaldo del Cerro}, D. and {van den Eijnden}, N.C. and P. Chall",

year = "2010",

month = nov,

day = "16",

language = "English",

pages = "--",

booktitle = "Proceedings ot the IEEE International 3D Systems Integration Conference 2010, 3DIC",

note = "IEEE International 3D Systems Integration Conference 2010, 3DIC : Proceedings ot the IEEE International 3D Systems Integration Conference 2010, 3DIC ; Conference date: 16-11-2010 Through 18-11-2010",

}

Oosterhuis, G, Huis in 't Veld, B, Ebberink, GHP, Arnaldo del Cerro, D, van den Eijnden, NC & Chall, P 2010, Additive interconnect fabrication by picosecond laser induced forward transfer. in Proceedings ot the IEEE International 3D Systems Integration Conference 2010, 3DIC. Munich, Germany, pp. -, IEEE International 3D Systems Integration Conference 2010, 3DIC, Munich, Germany, 16/11/10.

Additive interconnect fabrication by picosecond laser induced forward transfer. / Oosterhuis, G.; Huis in 't Veld, Bert; Ebberink, G.H.P. et al.

Proceedings ot the IEEE International 3D Systems Integration Conference 2010, 3DIC. Munich, Germany, 2010. p. -.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Additive interconnect fabrication by picosecond laser induced forward transfer

AU - Oosterhuis, G.

AU - Huis in 't Veld, Bert

AU - Ebberink, G.H.P.

AU - Arnaldo del Cerro, D.

AU - van den Eijnden, N.C.

AU - Chall, P.

PY - 2010/11/16

Y1 - 2010/11/16

KW - METIS-269599

M3 - Conference contribution

SP - -

BT - Proceedings ot the IEEE International 3D Systems Integration Conference 2010, 3DIC

CY - Munich, Germany

T2 - IEEE International 3D Systems Integration Conference 2010, 3DIC

Y2 - 16 November 2010 through 18 November 2010

ER -