Aluminum nitride for heatspreading in RF IC's

Physics

• Frequencies 100%
• Deposition 100%
• Glass 100%
• Aluminium 100%
• Silicon 100%
• Value 50%
• Heat 50%
• Piezoelectricity 50%
• Isolation 50%
• Residual Stress 50%
• Thin Films 50%
• Junction Transistor 50%
• Cycles 50%
• Thermal Resistance 50%
• Thermal Conductivity 50%
• Substrates 50%
• Utilization 50%

Material Science

• Aluminum Nitride 100%
• Glass 50%
• Material 50%
• Silicon 50%
• Thermal Conductivity 25%
• Heat Resistance 25%
• Devices 25%
• Bipolar Transistor 25%
• Piezoelectricity 25%
• Thin Films 25%