An apparatus of planar heat pipe embedded in circuit board for cooling of heat-dissipating components

Wessel Willems Wits (Inventor), R. Legtenberg (Inventor), J. Mannak (Inventor), B. van Zalk (Inventor)

Research output: Patent

Original languageUndefined
Patent number1031206
Priority date22/02/06
Publication statusIn preparation - 22 Feb 2006

Keywords

  • METIS-238426

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