TY - JOUR
T1 - An electron-multiplying ''Micromegas'' grid made in silicon wafer post-processing technology
AU - Chefdeville, M.A.
AU - Colas, P.
AU - Giomataris, Y.
AU - van der Graaf, H.
AU - Heijne, E.H.M.
AU - van der Putten, Sipho
AU - Salm, C.
AU - Schmitz, J.
AU - Smits, S.
AU - Timmermans, J.
AU - Visschers, J.L.
PY - 2005/12/3
Y1 - 2005/12/3
N2 - A technology for manufacturing an aluminium grid onto a silicon wafer has been developed. The grid is fixed parallel and precisely to the wafer (anode) surface at a distance of 50 mm by means of insulating pillars. When some 400V are applied between the grid and (anode) wafer, gas multiplication occurs: primary electrons from the drift space above the grid enter the holes and cause electron
avalanches in the high-field region between the grid and the anode. Production and operational characteristics of the device are described. With this newly developed technology, CMOS (pixel) readout chips can be covered with a gas multiplication grid. Such a chip forms, together with the grid, an integrated device which can be applied as readout in a wide field of gaseous detectors.
AB - A technology for manufacturing an aluminium grid onto a silicon wafer has been developed. The grid is fixed parallel and precisely to the wafer (anode) surface at a distance of 50 mm by means of insulating pillars. When some 400V are applied between the grid and (anode) wafer, gas multiplication occurs: primary electrons from the drift space above the grid enter the holes and cause electron
avalanches in the high-field region between the grid and the anode. Production and operational characteristics of the device are described. With this newly developed technology, CMOS (pixel) readout chips can be covered with a gas multiplication grid. Such a chip forms, together with the grid, an integrated device which can be applied as readout in a wide field of gaseous detectors.
KW - SC-RID: Radiation Imaging detectors
KW - Electron gas multiplication
KW - Micromegas
KW - Integrated grid
KW - Wafer post-processing
KW - Microelectrodes
KW - Microsensors
KW - Wafer-scale integration
KW - SU-8
KW - 22/4 OA procedure
U2 - 10.1016/j.nima.2005.11.065
DO - 10.1016/j.nima.2005.11.065
M3 - Article
SN - 0168-9002
VL - 556
SP - 490
EP - 494
JO - Nuclear instruments & methods in physics research. Section A : Accelerators, spectrometers, detectors and associated equipment
JF - Nuclear instruments & methods in physics research. Section A : Accelerators, spectrometers, detectors and associated equipment
IS - 2
ER -