An experimental investigation on the thermal field of overlapping layers in laser-assisted tape winding process

S.M.A. Hosseini*, I. Baran, R. Akkerman

*Corresponding author for this work

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    5 Citations (Scopus)

    Abstract

    The laser-assisted tape winding (LATW) is an automated process for manufacturing fiber-reinforced thermoplastic tubular products, such as pipes and pressure vessels. Multi-physical phenomena such as heat transfer, mechanical bonding, phase changes and solid mechanics take place during the process. These phenomena need to be understood and described well for an improved product reliability. Temperature is one of the important parameters in this process to control and optimize the product quality which can be employed in an intelligent model-based inline control system. The incoming tape can overlap with the already wounded layer during the process based on the lay-up configuration. In this situation, the incoming tape can step-on or step-off to an already deposited layer/laminate. During the overlapping, the part temperature changes due to the variation of the geometry caused by previously deposited layer, i.e. a bump geometry. In order to qualify the temperature behavior at the bump regions, an experimental set up is designed on a flat laminate. Artificial bumps/steps are formed on the laminate with various thicknesses and fiber orientations. As the laser head experiences the step-on and step-off, the IR (Infra-Red) camera and the embedded thermocouples measure the temperature on the surface and inside the laminate, respectively. During the step-on, a small drop in temperature is observed while in step-off a higher peak in temperature is observed. It can be concluded that the change in the temperature during overlapping is due to the change in laser incident angle made by the bump geometry. The effect of the step thickness on the temperature peak is quantified and found to be significant.

    Original languageEnglish
    Title of host publicationProceedings of the 21st International ESAFORM Conference on Material Forming, ESAFORM 2018
    PublisherAmerican Institute of Physics
    ISBN (Electronic)9780735416635
    ISBN (Print)9780735416635
    DOIs
    Publication statusPublished - 2 May 2018
    Event21st International ESAFORM Conference on Material Forming, ESAFORM 2018 - Palermo, Italy
    Duration: 23 Apr 201825 Apr 2018
    Conference number: 21
    http://www.esaform2018.com/index.php/en/

    Conference

    Conference21st International ESAFORM Conference on Material Forming, ESAFORM 2018
    Abbreviated titleESAFORM 2018
    CountryItaly
    CityPalermo
    Period23/04/1825/04/18
    Internet address

    Fingerprint Dive into the research topics of 'An experimental investigation on the thermal field of overlapping layers in laser-assisted tape winding process'. Together they form a unique fingerprint.

    Cite this