Abstract
A process chain to fabricate conductive structures on printed circuit board material is presented in this thesis. This process chain comprises four main steps: plasma treatment, inkjet printing, electroless plating and functional characterisation. It represents a drastic reduction in the number of process steps when compared to the conventional lithography-based method, widely used in the printed circuit board industry.
Original language | English |
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Award date | 12 May 2010 |
Place of Publication | Enschede |
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Print ISBNs | 978-90-365-3027-9 |
DOIs | |
Publication status | Published - 12 May 2010 |