A process chain to fabricate conductive structures on printed circuit board material is presented in this thesis. This process chain comprises four main steps: plasma treatment, inkjet printing, electroless plating and functional characterisation. It represents a drastic reduction in the number of process steps when compared to the conventional lithography-based method, widely used in the printed circuit board industry.
|Award date||12 May 2010|
|Place of Publication||Enschede|
|Publication status||Published - 12 May 2010|