Anisotropic wet-chemical etching of silicon pits, peaks, principles, pyramids and particles

A.J. Nijdam

    Research output: ThesisPhD Thesis - Research UT, graduation UT

    2695 Downloads (Pure)

    Abstract

    Anisotropic wet-chemical etching is a key technology in the fabrication of sensors and actuators because it is fast and cheap. However, the exact nature of the etching process is still unclear. A deeper understanding of the physical chemistry of the etch process is sought by investigating the thermodynamics and chemistry, the difference in underetch rate of apparently identical structures, typical surface structures and finally by computer simulation of the etch rate plot.
    Original languageEnglish
    Supervisors/Advisors
    • Elwenspoek, Michael Curt, Supervisor
    • Gardeniers, J.G.E., Advisor
    • Vlieg, Elias, Supervisor, External person
    Thesis sponsors
    Award date18 Jan 2001
    Place of PublicationEnschede
    Publisher
    Print ISBNs90 365 15351
    Publication statusPublished - 18 Jan 2001

    Keywords

    • EWI-14281
    • IR-38679
    • METIS-111378

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