@inproceedings{75112aad090f4075a8bd230586da74fd,
title = "Application of 1.7-kV 700-A SiC LinPak to Optimize LCL Grid-Tied Converters",
abstract = "The current rating of SiC MOSFETs has been increased ever since its introduction. Yet, high current modules for 690-V and beyond grid applications, which would enable the realization of megawatt range converters, are not readily commercially available. Recently, a new high current 1.7-kV SiC MOSFET module suitable for hard-parallel connection to increase the current rating has been introduced. This paper investigates the system-level benefit of this module for a 2-level 690-V 1-MW grid-tied converter regarding achievable efficiency and power density and benchmarks the results against the achievable performance with conventional Si IGBTs. The study analyzes in detail the impact of the number of paralleled modules, the choice of the cooling system and the filter design.",
keywords = "Silicon carbide, Cooling, Silicon, Thermal resistance, Heat transfer, Density measurement, Power system measurements, n/a OA procedure",
author = "Ki-Bum Park and Burkart, \{Ralph M.\} and Bruno Agostini and Soeiro, \{Thiago B.\}",
year = "2019",
month = may,
day = "30",
doi = "10.23919/ICPE2019-ECCEAsia42246.2019.8797170",
language = "English",
isbn = "978-1-7281-1612-9",
series = "International Conference on Power Electronics and ECCE Asia (ICPE - ECCE Asia)",
publisher = "IEEE",
pages = "1--7",
booktitle = "2019 10th International Conference on Power Electronics and ECCE Asia (ICPE 2019 - ECCE Asia)",
address = "United States",
note = "10th International Conference on Power Electronics - ECCE Asia, ICPE 2019 - ECCE Asia ; Conference date: 27-05-2019 Through 30-05-2019",
}