Application of Dielectric, Ferroelectric and Piezoelectric Thin Film Devices in Mobile Communication and Medical Systems

M. Klee, D. Beelen, W. Keurl, R. Kiewitt, B. Kumar, R. Mauczok, K. Reimann, Ch. Renders, A. Roest, F. Roozeboom, P.G. Steeneken, M.P.J. Tiggelman, F. Vanhelmont, O. Wunnicke, P. Lok, K. Neumann, J. Fraser, G. Schmitz

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    Abstract

    Dielectric, ferroelectric and piezoelectric thin films are getting more and more attention for next generation mobile communication and medical systems. Thin film technologies based on dielectric, ferroelectric and piezoelectric thin films enable System-in-Package (SiP) devices, resulting in optimal integration of various functions in one module with respect to high performance, small size and low cost. Within Philips a passive integration platform for SiP technologies is developed, comprising key functions such as RF filters, micro-electromechanical switches, high-value capacitors as well as passive and active functions integrated in small modules. The piezoelectric thin film technologies do not only play a role for RF filters, but are also a breakthrough technology for a new class of thin film ultrasonic transducers.
    Original languageUndefined
    Title of host publication15th ieee international symposium on the Applications of ferroelectrics, 2006. isaf '06
    Place of PublicationPiscataway
    PublisherIEEE Computer Society Press
    Pages9-16
    Number of pages8
    ISBN (Print)978-1-4244-1332-4
    DOIs
    Publication statusPublished - 21 Nov 2007
    Event15th IEEE International Symposium on the Applications of Ferroelectrics, ISAF 2006 - Sunset Beach, United States
    Duration: 30 Jul 20063 Aug 2006
    Conference number: 15

    Publication series

    Name
    PublisherIEEE Computer Society Press
    Number7
    ISSN (Print)1099-4734

    Conference

    Conference15th IEEE International Symposium on the Applications of Ferroelectrics, ISAF 2006
    Abbreviated titleISAF
    CountryUnited States
    CitySunset Beach
    Period30/07/063/08/06

    Keywords

    • EWI-11912
    • SC-ICF: Integrated Circuit Fabrication
    • IR-62169
    • Dielectric
    • METIS-246018
    • System in Package
    • thin film ultrasonic transducers
    • piezoelectric thin films
    • Ferroelectric

    Cite this

    Klee, M., Beelen, D., Keurl, W., Kiewitt, R., Kumar, B., Mauczok, R., ... Schmitz, G. (2007). Application of Dielectric, Ferroelectric and Piezoelectric Thin Film Devices in Mobile Communication and Medical Systems. In 15th ieee international symposium on the Applications of ferroelectrics, 2006. isaf '06 (pp. 9-16). [10.1109/ISAF.2006.4387821] Piscataway: IEEE Computer Society Press. https://doi.org/10.1109/ISAF.2006.4387821
    Klee, M. ; Beelen, D. ; Keurl, W. ; Kiewitt, R. ; Kumar, B. ; Mauczok, R. ; Reimann, K. ; Renders, Ch. ; Roest, A. ; Roozeboom, F. ; Steeneken, P.G. ; Tiggelman, M.P.J. ; Vanhelmont, F. ; Wunnicke, O. ; Lok, P. ; Neumann, K. ; Fraser, J. ; Schmitz, G. / Application of Dielectric, Ferroelectric and Piezoelectric Thin Film Devices in Mobile Communication and Medical Systems. 15th ieee international symposium on the Applications of ferroelectrics, 2006. isaf '06. Piscataway : IEEE Computer Society Press, 2007. pp. 9-16
    @inproceedings{c2e7597b69074060bdd8d57501e520c0,
    title = "Application of Dielectric, Ferroelectric and Piezoelectric Thin Film Devices in Mobile Communication and Medical Systems",
    abstract = "Dielectric, ferroelectric and piezoelectric thin films are getting more and more attention for next generation mobile communication and medical systems. Thin film technologies based on dielectric, ferroelectric and piezoelectric thin films enable System-in-Package (SiP) devices, resulting in optimal integration of various functions in one module with respect to high performance, small size and low cost. Within Philips a passive integration platform for SiP technologies is developed, comprising key functions such as RF filters, micro-electromechanical switches, high-value capacitors as well as passive and active functions integrated in small modules. The piezoelectric thin film technologies do not only play a role for RF filters, but are also a breakthrough technology for a new class of thin film ultrasonic transducers.",
    keywords = "EWI-11912, SC-ICF: Integrated Circuit Fabrication, IR-62169, Dielectric, METIS-246018, System in Package, thin film ultrasonic transducers, piezoelectric thin films, Ferroelectric",
    author = "M. Klee and D. Beelen and W. Keurl and R. Kiewitt and B. Kumar and R. Mauczok and K. Reimann and Ch. Renders and A. Roest and F. Roozeboom and P.G. Steeneken and M.P.J. Tiggelman and F. Vanhelmont and O. Wunnicke and P. Lok and K. Neumann and J. Fraser and G. Schmitz",
    note = "eemcs-eprint-11912",
    year = "2007",
    month = "11",
    day = "21",
    doi = "10.1109/ISAF.2006.4387821",
    language = "Undefined",
    isbn = "978-1-4244-1332-4",
    publisher = "IEEE Computer Society Press",
    number = "7",
    pages = "9--16",
    booktitle = "15th ieee international symposium on the Applications of ferroelectrics, 2006. isaf '06",

    }

    Klee, M, Beelen, D, Keurl, W, Kiewitt, R, Kumar, B, Mauczok, R, Reimann, K, Renders, C, Roest, A, Roozeboom, F, Steeneken, PG, Tiggelman, MPJ, Vanhelmont, F, Wunnicke, O, Lok, P, Neumann, K, Fraser, J & Schmitz, G 2007, Application of Dielectric, Ferroelectric and Piezoelectric Thin Film Devices in Mobile Communication and Medical Systems. in 15th ieee international symposium on the Applications of ferroelectrics, 2006. isaf '06., 10.1109/ISAF.2006.4387821, IEEE Computer Society Press, Piscataway, pp. 9-16, 15th IEEE International Symposium on the Applications of Ferroelectrics, ISAF 2006, Sunset Beach, United States, 30/07/06. https://doi.org/10.1109/ISAF.2006.4387821

    Application of Dielectric, Ferroelectric and Piezoelectric Thin Film Devices in Mobile Communication and Medical Systems. / Klee, M.; Beelen, D.; Keurl, W.; Kiewitt, R.; Kumar, B.; Mauczok, R.; Reimann, K.; Renders, Ch.; Roest, A.; Roozeboom, F.; Steeneken, P.G.; Tiggelman, M.P.J.; Vanhelmont, F.; Wunnicke, O.; Lok, P.; Neumann, K.; Fraser, J.; Schmitz, G.

    15th ieee international symposium on the Applications of ferroelectrics, 2006. isaf '06. Piscataway : IEEE Computer Society Press, 2007. p. 9-16 10.1109/ISAF.2006.4387821.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

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    AU - Keurl, W.

    AU - Kiewitt, R.

    AU - Kumar, B.

    AU - Mauczok, R.

    AU - Reimann, K.

    AU - Renders, Ch.

    AU - Roest, A.

    AU - Roozeboom, F.

    AU - Steeneken, P.G.

    AU - Tiggelman, M.P.J.

    AU - Vanhelmont, F.

    AU - Wunnicke, O.

    AU - Lok, P.

    AU - Neumann, K.

    AU - Fraser, J.

    AU - Schmitz, G.

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    N2 - Dielectric, ferroelectric and piezoelectric thin films are getting more and more attention for next generation mobile communication and medical systems. Thin film technologies based on dielectric, ferroelectric and piezoelectric thin films enable System-in-Package (SiP) devices, resulting in optimal integration of various functions in one module with respect to high performance, small size and low cost. Within Philips a passive integration platform for SiP technologies is developed, comprising key functions such as RF filters, micro-electromechanical switches, high-value capacitors as well as passive and active functions integrated in small modules. The piezoelectric thin film technologies do not only play a role for RF filters, but are also a breakthrough technology for a new class of thin film ultrasonic transducers.

    AB - Dielectric, ferroelectric and piezoelectric thin films are getting more and more attention for next generation mobile communication and medical systems. Thin film technologies based on dielectric, ferroelectric and piezoelectric thin films enable System-in-Package (SiP) devices, resulting in optimal integration of various functions in one module with respect to high performance, small size and low cost. Within Philips a passive integration platform for SiP technologies is developed, comprising key functions such as RF filters, micro-electromechanical switches, high-value capacitors as well as passive and active functions integrated in small modules. The piezoelectric thin film technologies do not only play a role for RF filters, but are also a breakthrough technology for a new class of thin film ultrasonic transducers.

    KW - EWI-11912

    KW - SC-ICF: Integrated Circuit Fabrication

    KW - IR-62169

    KW - Dielectric

    KW - METIS-246018

    KW - System in Package

    KW - thin film ultrasonic transducers

    KW - piezoelectric thin films

    KW - Ferroelectric

    U2 - 10.1109/ISAF.2006.4387821

    DO - 10.1109/ISAF.2006.4387821

    M3 - Conference contribution

    SN - 978-1-4244-1332-4

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    BT - 15th ieee international symposium on the Applications of ferroelectrics, 2006. isaf '06

    PB - IEEE Computer Society Press

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    Klee M, Beelen D, Keurl W, Kiewitt R, Kumar B, Mauczok R et al. Application of Dielectric, Ferroelectric and Piezoelectric Thin Film Devices in Mobile Communication and Medical Systems. In 15th ieee international symposium on the Applications of ferroelectrics, 2006. isaf '06. Piscataway: IEEE Computer Society Press. 2007. p. 9-16. 10.1109/ISAF.2006.4387821 https://doi.org/10.1109/ISAF.2006.4387821