Dielectric, ferroelectric and piezoelectric thin films are getting more and more attention for next generation mobile communication and medical systems. Thin film technologies based on dielectric, ferroelectric and piezoelectric thin films enable System-in-Package (SiP) devices, resulting in optimal integration of various functions in one module with respect to high performance, small size and low cost. Within Philips a passive integration platform for SiP technologies is developed, comprising key functions such as RF filters, micro-electromechanical switches, high-value capacitors as well as passive and active functions integrated in small modules. The piezoelectric thin film technologies do not only play a role for RF filters, but are also a breakthrough technology for a new class of thin film ultrasonic transducers.
|Publisher||IEEE Computer Society Press|
|Conference||15th IEEE International Symposium on the Applications of Ferroelectrics, ISAF 2006|
|Period||30/07/06 → 3/08/06|
- SC-ICF: Integrated Circuit Fabrication
- System in Package
- thin film ultrasonic transducers
- piezoelectric thin films