Application of Dielectric, Ferroelectric and Piezoelectric Thin Film Devices in Mobile Communication and Medical Systems

M. Klee, D. Beelen, W. Keurl, R. Kiewitt, B. Kumar, R. Mauczok, K. Reimann, Ch. Renders, A. Roest, F. Roozeboom, P.G. Steeneken, M.P.J. Tiggelman, F. Vanhelmont, O. Wunnicke, P. Lok, K. Neumann, J. Fraser, G. Schmitz

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review


    Dielectric, ferroelectric and piezoelectric thin films are getting more and more attention for next generation mobile communication and medical systems. Thin film technologies based on dielectric, ferroelectric and piezoelectric thin films enable System-in-Package (SiP) devices, resulting in optimal integration of various functions in one module with respect to high performance, small size and low cost. Within Philips a passive integration platform for SiP technologies is developed, comprising key functions such as RF filters, micro-electromechanical switches, high-value capacitors as well as passive and active functions integrated in small modules. The piezoelectric thin film technologies do not only play a role for RF filters, but are also a breakthrough technology for a new class of thin film ultrasonic transducers.
    Original languageUndefined
    Title of host publication15th ieee international symposium on the Applications of ferroelectrics, 2006. isaf '06
    Place of PublicationPiscataway
    Number of pages8
    ISBN (Print)978-1-4244-1332-4
    Publication statusPublished - 21 Nov 2007
    Event15th IEEE International Symposium on the Applications of Ferroelectrics, ISAF 2006 - Sunset Beach, United States
    Duration: 30 Jul 20063 Aug 2006
    Conference number: 15

    Publication series

    PublisherIEEE Computer Society Press
    ISSN (Print)1099-4734


    Conference15th IEEE International Symposium on the Applications of Ferroelectrics, ISAF 2006
    Abbreviated titleISAF
    Country/TerritoryUnited States
    CitySunset Beach


    • EWI-11912
    • SC-ICF: Integrated Circuit Fabrication
    • IR-62169
    • Dielectric
    • METIS-246018
    • System in Package
    • thin film ultrasonic transducers
    • piezoelectric thin films
    • Ferroelectric

    Cite this