Application of Dielectric, Ferroelectric and Piezoelectric Thin Film Devices in Mobile Communication and Medical Systems

M. Klee; D. Beelen; W. Keurl; R. Kiewitt; B. Kumar; R. Mauczok; K. Reimann; Ch. Renders; A. Roest; F. Roozeboom; P.G. Steeneken; M.P.J. Tiggelman; F. Vanhelmont; O. Wunnicke; P. Lok; K. Neumann; J. Fraser; G. Schmitz

doi:10.1109/ISAF.2006.4387821

Application of Dielectric, Ferroelectric and Piezoelectric Thin Film Devices in Mobile Communication and Medical Systems

M. Klee, D. Beelen, W. Keurl, R. Kiewitt, B. Kumar, R. Mauczok, K. Reimann, Ch. Renders, A. Roest, F. Roozeboom, P.G. Steeneken, M.P.J. Tiggelman, F. Vanhelmont, O. Wunnicke, P. Lok, K. Neumann, J. Fraser, G. Schmitz

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

Abstract

Dielectric, ferroelectric and piezoelectric thin films are getting more and more attention for next generation mobile communication and medical systems. Thin film technologies based on dielectric, ferroelectric and piezoelectric thin films enable System-in-Package (SiP) devices, resulting in optimal integration of various functions in one module with respect to high performance, small size and low cost. Within Philips a passive integration platform for SiP technologies is developed, comprising key functions such as RF filters, micro-electromechanical switches, high-value capacitors as well as passive and active functions integrated in small modules. The piezoelectric thin film technologies do not only play a role for RF filters, but are also a breakthrough technology for a new class of thin film ultrasonic transducers.

Original language	Undefined
Title of host publication	15th ieee international symposium on the Applications of ferroelectrics, 2006. isaf '06
Place of Publication	Piscataway
Publisher	IEEE
Pages	9-16
Number of pages	8
ISBN (Print)	978-1-4244-1332-4
DOIs	https://doi.org/10.1109/ISAF.2006.4387821
Publication status	Published - 21 Nov 2007
Event	15th IEEE International Symposium on the Applications of Ferroelectrics, ISAF 2006 - Sunset Beach, United States Duration: 30 Jul 2006 → 3 Aug 2006 Conference number: 15

Publication series

Name
Publisher	IEEE Computer Society Press
Number	7
ISSN (Print)	1099-4734

Conference

Conference	15th IEEE International Symposium on the Applications of Ferroelectrics, ISAF 2006
Abbreviated title	ISAF
Country/Territory	United States
City	Sunset Beach
Period	30/07/06 → 3/08/06

Keywords

EWI-11912
SC-ICF: Integrated Circuit Fabrication
IR-62169
Dielectric
METIS-246018
System in Package
thin film ultrasonic transducers
piezoelectric thin films
Ferroelectric

Access to Document

10.1109/ISAF.2006.4387821

http://eprints.eemcs.utwente.nl/secure2/11912/01/savedrecs2.pdf

Cite this

Klee, M., Beelen, D., Keurl, W., Kiewitt, R., Kumar, B., Mauczok, R., Reimann, K., Renders, C., Roest, A., Roozeboom, F., Steeneken, P. G., Tiggelman, M. P. J., Vanhelmont, F., Wunnicke, O., Lok, P., Neumann, K., Fraser, J., & Schmitz, G. (2007). Application of Dielectric, Ferroelectric and Piezoelectric Thin Film Devices in Mobile Communication and Medical Systems. In 15th ieee international symposium on the Applications of ferroelectrics, 2006. isaf '06 (pp. 9-16). [10.1109/ISAF.2006.4387821] IEEE. https://doi.org/10.1109/ISAF.2006.4387821

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title = "Application of Dielectric, Ferroelectric and Piezoelectric Thin Film Devices in Mobile Communication and Medical Systems",

abstract = "Dielectric, ferroelectric and piezoelectric thin films are getting more and more attention for next generation mobile communication and medical systems. Thin film technologies based on dielectric, ferroelectric and piezoelectric thin films enable System-in-Package (SiP) devices, resulting in optimal integration of various functions in one module with respect to high performance, small size and low cost. Within Philips a passive integration platform for SiP technologies is developed, comprising key functions such as RF filters, micro-electromechanical switches, high-value capacitors as well as passive and active functions integrated in small modules. The piezoelectric thin film technologies do not only play a role for RF filters, but are also a breakthrough technology for a new class of thin film ultrasonic transducers.",

keywords = "EWI-11912, SC-ICF: Integrated Circuit Fabrication, IR-62169, Dielectric, METIS-246018, System in Package, thin film ultrasonic transducers, piezoelectric thin films, Ferroelectric",

author = "M. Klee and D. Beelen and W. Keurl and R. Kiewitt and B. Kumar and R. Mauczok and K. Reimann and Ch. Renders and A. Roest and F. Roozeboom and P.G. Steeneken and M.P.J. Tiggelman and F. Vanhelmont and O. Wunnicke and P. Lok and K. Neumann and J. Fraser and G. Schmitz",

note = "eemcs-eprint-11912 ; 15th IEEE International Symposium on the Applications of Ferroelectrics, ISAF 2006 ; Conference date: 30-07-2006 Through 03-08-2006",

year = "2007",

month = nov,

day = "21",

doi = "10.1109/ISAF.2006.4387821",

language = "Undefined",

isbn = "978-1-4244-1332-4",

publisher = "IEEE",

number = "7",

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booktitle = "15th ieee international symposium on the Applications of ferroelectrics, 2006. isaf '06",

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Klee, M, Beelen, D, Keurl, W, Kiewitt, R, Kumar, B, Mauczok, R, Reimann, K, Renders, C, Roest, A, Roozeboom, F, Steeneken, PG, Tiggelman, MPJ, Vanhelmont, F, Wunnicke, O, Lok, P, Neumann, K, Fraser, J & Schmitz, G 2007, Application of Dielectric, Ferroelectric and Piezoelectric Thin Film Devices in Mobile Communication and Medical Systems. in 15th ieee international symposium on the Applications of ferroelectrics, 2006. isaf '06., 10.1109/ISAF.2006.4387821, IEEE, Piscataway, pp. 9-16, 15th IEEE International Symposium on the Applications of Ferroelectrics, ISAF 2006, Sunset Beach, North Carolina, United States, 30/07/06. https://doi.org/10.1109/ISAF.2006.4387821

Application of Dielectric, Ferroelectric and Piezoelectric Thin Film Devices in Mobile Communication and Medical Systems. / Klee, M.; Beelen, D.; Keurl, W. et al.
15th ieee international symposium on the Applications of ferroelectrics, 2006. isaf '06. Piscataway: IEEE, 2007. p. 9-16 10.1109/ISAF.2006.4387821.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Application of Dielectric, Ferroelectric and Piezoelectric Thin Film Devices in Mobile Communication and Medical Systems

AU - Klee, M.

AU - Beelen, D.

AU - Keurl, W.

AU - Kiewitt, R.

AU - Kumar, B.

AU - Mauczok, R.

AU - Reimann, K.

AU - Renders, Ch.

AU - Roest, A.

AU - Roozeboom, F.

AU - Steeneken, P.G.

AU - Tiggelman, M.P.J.

AU - Vanhelmont, F.

AU - Wunnicke, O.

AU - Lok, P.

AU - Neumann, K.

AU - Fraser, J.

AU - Schmitz, G.

N1 - Conference code: 15

PY - 2007/11/21

Y1 - 2007/11/21

N2 - Dielectric, ferroelectric and piezoelectric thin films are getting more and more attention for next generation mobile communication and medical systems. Thin film technologies based on dielectric, ferroelectric and piezoelectric thin films enable System-in-Package (SiP) devices, resulting in optimal integration of various functions in one module with respect to high performance, small size and low cost. Within Philips a passive integration platform for SiP technologies is developed, comprising key functions such as RF filters, micro-electromechanical switches, high-value capacitors as well as passive and active functions integrated in small modules. The piezoelectric thin film technologies do not only play a role for RF filters, but are also a breakthrough technology for a new class of thin film ultrasonic transducers.

AB - Dielectric, ferroelectric and piezoelectric thin films are getting more and more attention for next generation mobile communication and medical systems. Thin film technologies based on dielectric, ferroelectric and piezoelectric thin films enable System-in-Package (SiP) devices, resulting in optimal integration of various functions in one module with respect to high performance, small size and low cost. Within Philips a passive integration platform for SiP technologies is developed, comprising key functions such as RF filters, micro-electromechanical switches, high-value capacitors as well as passive and active functions integrated in small modules. The piezoelectric thin film technologies do not only play a role for RF filters, but are also a breakthrough technology for a new class of thin film ultrasonic transducers.

KW - EWI-11912

KW - SC-ICF: Integrated Circuit Fabrication

KW - IR-62169

KW - Dielectric

KW - METIS-246018

KW - System in Package

KW - thin film ultrasonic transducers

KW - piezoelectric thin films

KW - Ferroelectric

U2 - 10.1109/ISAF.2006.4387821

DO - 10.1109/ISAF.2006.4387821

M3 - Conference contribution

SN - 978-1-4244-1332-4

SP - 9

EP - 16

BT - 15th ieee international symposium on the Applications of ferroelectrics, 2006. isaf '06

PB - IEEE

CY - Piscataway

T2 - 15th IEEE International Symposium on the Applications of Ferroelectrics, ISAF 2006

Y2 - 30 July 2006 through 3 August 2006

ER -