Abstract
Several thin-film deposition and etching techniques of the polymer fluorocarbon are investigated and the resulting thin-film properties will be compared with those of commercially available bulk polytetrafluoroethylene. The most promising deposition technique is performed in a conventional reactive ion etcher using a carbonhydrotrifluoride (CHF3) plasma. By changing the deposition parameters, control of the properties and step coverage of the deposited thin films within a certain range is possible, e.g., unidirectional and conformal step coverage of deposited thin films can be obtained. Etching is performed with the help of an evaporated aluminum oxide mask.
| Original language | English |
|---|---|
| Pages (from-to) | 136-140 |
| Number of pages | 5 |
| Journal | Sensors and Actuators A: Physical |
| Volume | 41 |
| Issue number | 1-3 |
| DOIs | |
| Publication status | Published - 1 Apr 1994 |
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SDG 9 Industry, Innovation, and Infrastructure
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