Bond strength tests between silicon wafers and duran tubes (fusion bonded fluidic interconnects)

I. Fazal, Johan W. Berenschot, J.H. de Boer, Henricus V. Jansen, Michael Curt Elwenspoek

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    6 Citations (Scopus)
    246 Downloads (Pure)

    Abstract

    The fusion bond strength of glass tubes with standard silicon wafers is presented. Experiments with plain silicon wafers and those coated with silicon oxide and silicon nitride are presented. Results obtained are discussed in terms of homogeneity and strength of fusion bond. High pressure testing shows that the bond strength is large enough for most applications of fluidic interconnects. The bond strength for 525 /spl mu/m thick silicon with glass tubes having outer diameter of 6 mm and with wall thickness 2 mm, is more than 60 bars after annealing at a temperature of 800/spl deg/C.
    Original languageUndefined
    Title of host publicationThe 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05.
    Place of PublicationLos Alamitos
    PublisherIEEE
    Pages936-939
    Number of pages4
    ISBN (Print)0-7803-8994-8
    DOIs
    Publication statusPublished - 5 Jun 2005
    Event13th International Conferences on Solid-State Sensors, Actuators and Mircosystems, TRANSDUCERS 2005 - Seoul, Korea, Republic of
    Duration: 5 Jun 20059 Jun 2005
    Conference number: 13

    Publication series

    NameSolid-State Sensors, Actuators and Microsystems
    PublisherIEEE Computer Society
    Number05TH8791
    Volume1

    Conference

    Conference13th International Conferences on Solid-State Sensors, Actuators and Mircosystems, TRANSDUCERS 2005
    Abbreviated titleTRANSDUCERS
    CountryKorea, Republic of
    CitySeoul
    Period5/06/059/06/05

    Keywords

    • EWI-9989
    • IR-52563
    • METIS-224176

    Cite this

    Fazal, I., Berenschot, J. W., de Boer, J. H., Jansen, H. V., & Elwenspoek, M. C. (2005). Bond strength tests between silicon wafers and duran tubes (fusion bonded fluidic interconnects). In The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. (pp. 936-939). (Solid-State Sensors, Actuators and Microsystems; Vol. 1, No. 05TH8791). Los Alamitos: IEEE. https://doi.org/10.1109/SENSOR.2005.1496572