Bond strength tests between silicon wafers and duran tubes (fusion bonded fluidic interconnects)

I. Fazal; Johan W. Berenschot; J.H. de Boer; Henricus V. Jansen; Michael Curt Elwenspoek

doi:10.1109/SENSOR.2005.1496572

Bond strength tests between silicon wafers and duran tubes (fusion bonded fluidic interconnects)

I. Fazal, Johan W. Berenschot, J.H. de Boer, Henricus V. Jansen, Michael Curt Elwenspoek

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

6 Citations (Scopus)

546 Downloads (Pure)

Abstract

The fusion bond strength of glass tubes with standard silicon wafers is presented. Experiments with plain silicon wafers and those coated with silicon oxide and silicon nitride are presented. Results obtained are discussed in terms of homogeneity and strength of fusion bond. High pressure testing shows that the bond strength is large enough for most applications of fluidic interconnects. The bond strength for 525 /spl mu/m thick silicon with glass tubes having outer diameter of 6 mm and with wall thickness 2 mm, is more than 60 bars after annealing at a temperature of 800/spl deg/C.

Original language	Undefined
Title of host publication	The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05.
Place of Publication	Los Alamitos
Publisher	IEEE
Pages	936-939
Number of pages	4
ISBN (Print)	0-7803-8994-8
DOIs	https://doi.org/10.1109/SENSOR.2005.1496572
Publication status	Published - 5 Jun 2005
Event	13th International Conferences on Solid-State Sensors, Actuators and Mircosystems, TRANSDUCERS 2005 - Seoul, Korea, Republic of Duration: 5 Jun 2005 → 9 Jun 2005 Conference number: 13

Publication series

Name	Solid-State Sensors, Actuators and Microsystems
Publisher	IEEE Computer Society
Number	05TH8791
Volume	1

Conference

Conference	13th International Conferences on Solid-State Sensors, Actuators and Mircosystems, TRANSDUCERS 2005
Abbreviated title	TRANSDUCERS
Country/Territory	Korea, Republic of
City	Seoul
Period	5/06/05 → 9/06/05

Keywords

EWI-9989
IR-52563
METIS-224176

Access to Document

10.1109/SENSOR.2005.1496572

Cite this

Fazal, I., Berenschot, J. W., de Boer, J. H., Jansen, H. V., & Elwenspoek, M. C. (2005). Bond strength tests between silicon wafers and duran tubes (fusion bonded fluidic interconnects). In The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. (pp. 936-939). (Solid-State Sensors, Actuators and Microsystems; Vol. 1, No. 05TH8791). IEEE. https://doi.org/10.1109/SENSOR.2005.1496572

Fazal, I. ; Berenschot, Johan W. ; de Boer, J.H. et al. / Bond strength tests between silicon wafers and duran tubes (fusion bonded fluidic interconnects). The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05.. Los Alamitos : IEEE, 2005. pp. 936-939 (Solid-State Sensors, Actuators and Microsystems; 05TH8791).

@inproceedings{e6e68533cb214b90acff311c65920a81,

title = "Bond strength tests between silicon wafers and duran tubes (fusion bonded fluidic interconnects)",

abstract = "The fusion bond strength of glass tubes with standard silicon wafers is presented. Experiments with plain silicon wafers and those coated with silicon oxide and silicon nitride are presented. Results obtained are discussed in terms of homogeneity and strength of fusion bond. High pressure testing shows that the bond strength is large enough for most applications of fluidic interconnects. The bond strength for 525 /spl mu/m thick silicon with glass tubes having outer diameter of 6 mm and with wall thickness 2 mm, is more than 60 bars after annealing at a temperature of 800/spl deg/C.",

keywords = "EWI-9989, IR-52563, METIS-224176",

author = "I. Fazal and Berenschot, {Johan W.} and {de Boer}, J.H. and Jansen, {Henricus V.} and Elwenspoek, {Michael Curt}",

year = "2005",

month = jun,

day = "5",

doi = "10.1109/SENSOR.2005.1496572",

language = "Undefined",

isbn = "0-7803-8994-8",

series = "Solid-State Sensors, Actuators and Microsystems",

publisher = "IEEE",

number = "05TH8791",

pages = "936--939",

booktitle = "The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05.",

address = "United States",

note = "13th International Conferences on Solid-State Sensors, Actuators and Mircosystems, TRANSDUCERS 2005 ; Conference date: 05-06-2005 Through 09-06-2005",

}

Fazal, I, Berenschot, JW, de Boer, JH, Jansen, HV & Elwenspoek, MC 2005, Bond strength tests between silicon wafers and duran tubes (fusion bonded fluidic interconnects). in The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05.. Solid-State Sensors, Actuators and Microsystems, no. 05TH8791, vol. 1, IEEE, Los Alamitos, pp. 936-939, 13th International Conferences on Solid-State Sensors, Actuators and Mircosystems, TRANSDUCERS 2005, Seoul, Korea, Republic of, 5/06/05. https://doi.org/10.1109/SENSOR.2005.1496572

Bond strength tests between silicon wafers and duran tubes (fusion bonded fluidic interconnects). / Fazal, I.; Berenschot, Johan W.; de Boer, J.H. et al.
The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05.. Los Alamitos: IEEE, 2005. p. 936-939 (Solid-State Sensors, Actuators and Microsystems; Vol. 1, No. 05TH8791).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Bond strength tests between silicon wafers and duran tubes (fusion bonded fluidic interconnects)

AU - Fazal, I.

AU - Berenschot, Johan W.

AU - de Boer, J.H.

AU - Jansen, Henricus V.

AU - Elwenspoek, Michael Curt

N1 - Conference code: 13

PY - 2005/6/5

Y1 - 2005/6/5

N2 - The fusion bond strength of glass tubes with standard silicon wafers is presented. Experiments with plain silicon wafers and those coated with silicon oxide and silicon nitride are presented. Results obtained are discussed in terms of homogeneity and strength of fusion bond. High pressure testing shows that the bond strength is large enough for most applications of fluidic interconnects. The bond strength for 525 /spl mu/m thick silicon with glass tubes having outer diameter of 6 mm and with wall thickness 2 mm, is more than 60 bars after annealing at a temperature of 800/spl deg/C.

AB - The fusion bond strength of glass tubes with standard silicon wafers is presented. Experiments with plain silicon wafers and those coated with silicon oxide and silicon nitride are presented. Results obtained are discussed in terms of homogeneity and strength of fusion bond. High pressure testing shows that the bond strength is large enough for most applications of fluidic interconnects. The bond strength for 525 /spl mu/m thick silicon with glass tubes having outer diameter of 6 mm and with wall thickness 2 mm, is more than 60 bars after annealing at a temperature of 800/spl deg/C.

KW - EWI-9989

KW - IR-52563

KW - METIS-224176

U2 - 10.1109/SENSOR.2005.1496572

DO - 10.1109/SENSOR.2005.1496572

M3 - Conference contribution

SN - 0-7803-8994-8

T3 - Solid-State Sensors, Actuators and Microsystems

SP - 936

EP - 939

BT - The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05.

PB - IEEE

CY - Los Alamitos

T2 - 13th International Conferences on Solid-State Sensors, Actuators and Mircosystems, TRANSDUCERS 2005

Y2 - 5 June 2005 through 9 June 2005

ER -

Fazal I, Berenschot JW, de Boer JH, Jansen HV, Elwenspoek MC. Bond strength tests between silicon wafers and duran tubes (fusion bonded fluidic interconnects). In The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05.. Los Alamitos: IEEE. 2005. p. 936-939. (Solid-State Sensors, Actuators and Microsystems; 05TH8791). doi: 10.1109/SENSOR.2005.1496572